화학공학소재연구정보센터
검색결과 : 12건
No. Article
1 Long range, non-destructive characterization of GaN substrates for power devices
Gallagher JC, Anderson TJ, Luna LE, Koehler AD, Hite JK, Mahadik NA, Hobart KD, Kub FJ
Journal of Crystal Growth, 506, 178, 2019
2 Temperature and electric field induced metal-insulator transition in atomic layer deposited VO2 thin films
Tadjer MJ, Wheeler VD, Downey BP, Robinson ZR, Meyer DJ, Eddy CR, Kub FJ
Solid-State Electronics, 136, 30, 2017
3 Multicycle rapid thermal annealing technique and its application for the electrical activation of Mg implanted in GaN
Feigelson BN, Anderson TJ, Abraham M, Freitas JA, Hite JK, Eddy CR, Kub FJ
Journal of Crystal Growth, 350(1), 21, 2012
4 GaN vertical and lateral polarity heterostructures on GaN substrates
Hite JK, Bassim ND, Twigg ME, Mastro MA, Kub FJ, Eddy CR
Journal of Crystal Growth, 332(1), 43, 2011
5 Thick homoepitaxial GaN with low carrier concentration for high blocking voltage
Freitas JA, Mastro MA, Imhoff EA, Tadjer MJ, Eddy CR, Kub FJ
Journal of Crystal Growth, 312(18), 2616, 2010
6 Reaction Dynamics of Activated Hydrophobic Silicon for Low-Temperature Wafer Bonding
Breninford MP, Colinge CA, Holl SL, Hobart KD, Kub FJ
Journal of the Electrochemical Society, 156(5), H303, 2009
7 UV activation treatment for hydrophobic wafer bonding
Holl SL, Colinge CA, Hobart KD, Kub FJ
Journal of the Electrochemical Society, 153(7), G613, 2006
8 Direct wafer bonded abrupt junction tunnel diodes
Esser RH, Hobart KD, Kub FJ
Journal of the Electrochemical Society, 151(6), G387, 2004
9 Development of 3C-SiC SOI structures using Si on polycrystalline SiC wafer bonded substrates
Myers RL, Saddow SE, Rao S, Hobart KD, Fatemi M, Kub FJ
Materials Science Forum, 457-460, 1511, 2004
10 Improved low-temperature Si-Si hydrophilic wafer bonding
Esser RH, Hobart KD, Kub FJ
Journal of the Electrochemical Society, 150(3), G228, 2003