Simulation of Encapsulation Process for BGA Type Semi-conducting Microchip

Doo Han Bae; Myung Cheon Lee; Euy Soo Lee; Hyo Chang Yun; Jong Chan Lim; In Beom Kim

Journal of Industrial and Engineering Chemistry, Vol.9, No.2, 188-192, March, 2003

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Simulation of Encapsulation Process for BGA Type Semi-conducting Microchip

Doo Han Bae, Myung Cheon Lee^†, Euy Soo Lee , Hyo Chang Yun¹, Jong Chan Lim¹, and In Beom Kim²

Department of Chemical Engineering, Dongguk University, Seoul 100-715, Korea
¹Central Research Institute, Korea Chemical Co., Kyunggi-Do 449-910, Korea
²Kyungmin College, Kyunggi-Do 480-702, Korea

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The encapsulation process for semi-conductor chips is mainly affected by the thermal and rheological characteristics of EMC encapsulants. In this research, encapsulation processes for the BGA (Ball Grid Array) type chip were simulated after investigating the thermal and rheological characteriseics of EMC. The values of parameters involved in Kamal and Cross equations which were used in C-Mold were acquired by making regressions on the thermal and rheological data performed by DSC and RMS respectively. The simulation and experimental results showed that the dynamic characteristics of melt-front have good agreements with those of real short shot process.

Keywords:EMC;encapsulation;viscosity;BGA;semi-conducting microchip

[References]

Kim IB, Bae DH, Lee MC, Lee ES, Yun HC, Lim JC, J. Korean Ind. Eng. Chem., 10(6), 949 (1999)
Pecht MG, Nguyen LT, Hakim EB, Plastic Encapsulated Microelectronics; Materials, Processes, Quality Reliability, and Application, p. 55, John Wiley & Sons, New York (1995)
Tummula RR, Rymaszewski EJ, Klopfenstein AG, Microelectronics Packaging Handbook-Semiconductor Packaging, Part II, 2nd Edn., p. 407, Chapman & Hall, New York (1997)
Han S, Wang KK, Crouthamel DL, J. Electronic Packaging, 119, 247 (1997)
Han S, Wang KK, Proc. ASME Winter Annual Meeting, New Orleans, LA (1993)
Han S, Wang KK, Proc. SPE ANTEC, San Francisco, CA (1994)
Kim IB, Lee MC, Lee ES, J. Korean Ind. Eng. Chem., 10(8), 1175 (1999)

[Related Articles]

[1] Kim IB, Bae DH, Lee MC, Lee ES, Yun HC, Lim JC, J. Korean Ind. Eng. Chem., 10(6), 949 (1999)

[2] Pecht MG, Nguyen LT, Hakim EB, Plastic Encapsulated Microelectronics; Materials, Processes, Quality Reliability, and Application, p. 55, John Wiley & Sons, New York (1995)

[3] Tummula RR, Rymaszewski EJ, Klopfenstein AG, Microelectronics Packaging Handbook-Semiconductor Packaging, Part II, 2nd Edn., p. 407, Chapman & Hall, New York (1997)

[4] Han S, Wang KK, Crouthamel DL, J. Electronic Packaging, 119, 247 (1997)

[5] Han S, Wang KK, Proc. ASME Winter Annual Meeting, New Orleans, LA (1993)

[6] Han S, Wang KK, Proc. SPE ANTEC, San Francisco, CA (1994)

[7] Kim IB, Lee MC, Lee ES, J. Korean Ind. Eng. Chem., 10(8), 1175 (1999)