2299 - 2300 |
Symposium I: Silicon and germanium issues for future CMOS devices Preface Pelaz L, Mirabella S, Larsen AN |
2301 - 2306 |
Si versus Ge for future microelectronics Claeys C, Mitard J, Eneman G, Meuris M, Simon E |
2307 - 2313 |
Amorphization, recrystallization and end of range defects in germanium Claverie A, Koffel S, Cherkashin N, Benassayag G, Scheiblin P |
2314 - 2316 |
Divacancies at room temperature in germanium Slotte J, Kuitunen K, Kilpelainen S, Tuomisto F, Capan I |
2317 - 2322 |
Hydrogen in amorphous Si and Ge during solid phase epitaxy Johnson BC, Caradonna P, Pyke DJ, McCallum JC, Gortmaker P |
2323 - 2325 |
Honeycomb voids due to ion implantation in germanium Kaiser RJ, Koffel S, Pichler P, Bauer AJ, Amon B, Claverie A, Benassayag G, Scheiblin P, Frey L, Ryssel H |
2326 - 2329 |
Defects in Ge caused by sub-amorphizing self-implantation: Formation and dissolution Bisognin G, Vangelista S, Mastromatteo M, Napolitani E, De Salvador D, Carnera A, Berti M, Bruno E, Scapellato G, Terrasi A |
2330 - 2333 |
Majority carrier capture rates for transition metal impurities in germanium Lauwaert J, Clauws P |
2334 - 2337 |
High temperature nucleation of oxygen precipitates in Germanium-doped Czochralski silicon Chen JH, Ma XY, Yang DR |
2338 - 2341 |
Effect of Germanium content and strain on the formation of extended defects in ion implanted Silicon/Germanium Fazzini PF, Cristiano F, Talbot E, Ben Assayag G, Paul S, Lerch W, Pakfar A, Hartmann JM |
2342 - 2345 |
Defect control by Al deposition and the subsequent post-annealing for SiGe-on-insulator substrates with different Ge fractions Yang HG, Wang D, Nakashima H, Hirayama K, Kojima S, Ikeura S |
2346 - 2349 |
Correlated out-diffusion of nitrogen and in-diffusion of self-interstitials resulting in elimination of nitrogen-related deep centres Voronkov VV, Falster R |
2350 - 2353 |
Electrical properties of nitrogen-doped Float-Zoned silicon annealed in a range of 200 to 900 degrees C Voronkova GI, Batunina AV, Voronkov VV, Falster R, Golovina VN, Guliaeva AS, Tiurina NB |
2354 - 2356 |
Effect of Si and He implantation in the formation of ultra shallow junctions in Si Xu M, Regula G, Daineche R, Oliviero E, Hakim B, Ntsoenzok E, Pichaud B |
2357 - 2360 |
Thermally activated conduction mechanisms in Silicon Nitride MIS structures Kanapitsas A, Tsonos C, Triantis D, Stavrakas I, Anastasiadis C, Photopoulos P, Pissis P, Vamvakas VE |
2361 - 2364 |
Observation of a paramagnetic defect at the epitaxial Ge3N4/(111)Ge interface by electron spin resonance Nguyen APD, Stesmans A, Afanas'ev VV, Lieten RR, Borghs G |
2365 - 2369 |
Evolution of SiO2/Ge/HfO2(Ge) multilayer structure during high temperature annealing Sahin D, Yildiz I, Gencer AI, Aygun G, Slaoui A, Turan R |
2370 - 2373 |
Interdiffusion and growth of chromium silicide at the interface of Cr/Si(As) system during rapid thermal annealing Benkherbache H, Merabet A |
2374 - 2376 |
Interaction of point defects with impurities in the Si-SiO2 system and its influence on the properties of the interface Kropman D, Mellikov E, Opik A, Lott K, Karner T, Heinmaa I, Laas T, Medvid A, Skorupa W, Prucnal S, Rebohle L, Zvyagin S, Cizmar E, Ozerov M, Wosnitza J |
2377 - 2380 |
Formation of germanates on germanium by chemical vapor treatment Kalem S, Arthursson O, Romandic I |
2381 - 2385 |
Electronic structural details of donor-vacancy complexes in Si-doped Ge and Ge-doped Si Coutinho J, Castro F, Torres VJB, Carvalho A, Barroso M, Briddon PR |
2386 - 2389 |
Radiation enhanced diffusion of B in crystalline Ge Bruno E, Mirabella S, Scapellato G, Impellizzeri G, Terrasi A, Priolo F, Napolitani E, De Salvador D, Mastromatteo M, Carnera A |
2390 - 2393 |
Dopant diffusion and activation induced by sub-melt laser anneal within the co-implanted p plus polycrystalline silicon gate used in CMOS technologies Colin A, Morin P, Beneyton R, Pinzelli L, Mathiot D, Fogarassy E |
2394 - 2397 |
Modeling of phosphorus diffusion in Ge accounting for a cubic dependence of the diffusivity with the electron concentration Canneaux T, Mathiot D, Ponpon JP, Leroy Y |
2398 - 2401 |
Atomic scale study of a MOS structure with an ultra-low energy boron-implanted silicon substrate Duguay S, Ngamo M, Fazzini PF, Cristiano F, Daoud K, Pareige P |
2402 - 2405 |
Characterization of Arsenic segregation at Si/SiO2 interface by 3D atom probe tomography Ngamo M, Duguay S, Pichler P, Daoud K, Pareige P |
2406 - 2408 |
Atomic-scale study of the role of carbon on boron clustering Philippe T, Duguay S, Grob JJ, Mathiot D, Blavette D |
2409 - 2412 |
Equilibrium segregation coefficient and solid solubility of B in Czochralski Ge crystal growth Taishi T, Ohno Y, Yonenaga I |
2413 - 2417 |
Theory of defects in Si and Ge: Past, present and recent developments Estreicher SK, Backlund D, Gibbons TM |
2418 - 2421 |
First-principles study of near surface point defects stability in Si (100) and SiGe(100) Fetah S, Chikouche A, Dkhissi A, Esteve A, Rouhani MD, Landa G, Pochet P |
2422 - 2426 |
Molecular dynamics simulation of silicon oxidization Ganster P, Treglia G, Lancon F, Pochet P |
2427 - 2430 |
Transfer of physically-based models from process to device simulations: Application to advanced SOI MOSFETs Bazizi EM, Pakfar A, Fazzini PF, Cristiano F, Tavernier C, Claverie A, Zographos N, Zechner C, Scheid E |
2431 - 2436 |
Numerical analysis of temperature profile and thermal-stress during excimer laser induced heteroepitaxial growth of patterned amorphous silicon and germanium bi-layers deposited on Si(100) Conde JC, Martin E, Gontad F, Chiussi S, Fornarini L, Leon B |
2437 - 2441 |
Full-Band Monte Carlo investigation of hole mobilities in SiGe, SiC and SiGeC alloys Michaillat M, Rideau D, Aniel F, Tavernier C, Jaouen H |
2442 - 2447 |
Overlayer stress effects on defect formation in Si and Ge Cowern NEB, Bennett NS, Ahn C, Yoon JC, Hamm S, Lerch W, Kheyrandish H, Cristiano F, Pakfar A |
2448 - 2453 |
Atomistic modeling of defect diffusion and interdiffusion in SiGe heterostructures Castrillo P, Jaraiz M, Pinacho R, Rubio JE |
2454 - 2457 |
Formation of uniaxially strained SiGe by selective ion implantation technique Sawano K, Hoshi Y, Yamada A, Hiraoka Y, Usami N, Arimoto K, Nakagawa K, Shiraki Y |
2458 - 2461 |
Development of analytical model for strained silicon relaxation on (100) fully relaxed Si0.8Ge0.2 pseudo-substrates Figuet C, Kononchuk O |
2462 - 2465 |
Efficient relaxation of strained-SiGe layers induced by thermal oxidation Jang JH, Son SY, Lim W, Phen MS, Siebein K, Craciun V |
2466 - 2469 |
Tensile strain engineering of Si thin films using porous Si substrates Boucherif A, Blanchard NP, Regreny P, Marty O, Guillot G, Grenet G, Lysenko V |
2470 - 2473 |
325 nm-laser-excited micro-photoluminescence for strained Si films Wang D, Yang HG, Kitamura T, Nakashima H |
2474 - 2477 |
Dopant incorporation in thin strained Si layers implanted with Sb Azarov AY, Zamani A, Radamson HH, Vines L, Kuznetsov AY, Hallen A |
2478 - 2484 |
Future challenges in CMOS process modeling Pichler P, Burenkov A, Lorenz J, Kampen C, Frey L |
2485 - 2488 |
Defect introduction in Ge during inductively coupled plasma etching and Schottky barrier diode fabrication processes Auret FD, Coelho SMM, Myburg G, van Rensburg PJJ, Meyer WE |
2489 - 2492 |
P plus /n junction leakage in thin selectively grown Ge-in-STI substrates Eneman G, Yang R, Wang G, De Jaeger B, Loo R, Claeys C, Caymax M, Meuris M, Heyns MM, Simoen E |
2493 - 2496 |
Low-frequency noise assessment of the silicon passivation of Ge pMOSFETs Simoen E, Firrincieli A, Leys F, Loo R, De Jaeger B, Mitard J, Claeys C |
2497 - 2500 |
I-V and low frequency noise characterization of poly and amorphous silicon Ti- and Co-salicide resistors Raoult J, Pascal F, Leyris C |
2501 - 2504 |
Germanium on insulator near-infrared photodetectors fabricated by layer transfer Sorianello V, De Iacovo A, Colace L, Assanto G, Fulgoni D, Nash L, Palmer M |
2505 - 2508 |
Electrical characterization of high-k gate dielectrics on Ge with HfGeN and GeO2 interlayers Hirayama K, Kira W, Yoshino K, Yang HG, Wang D, Nakashima H |
2509 - 2512 |
Effects of tunnel oxide process on SONOS flash memory characteristics Li DH, Park IH, Yun JG, Park BG |
2513 - 2516 |
Device performance of p-Ge MOSFETs at liquid nitrogen temperature Ohyama H, Sukizaki H, Takakura K, Motoki M, Matsuo K, Nakamura H, Sawada M, Midorikawa C, Kuboyama S, De Jaeger B, Simoen E, Claeys C |
2517 - 2520 |
Effects of electron irradiation on SiGe devices Ohyama H, Nagano T, Takakura K, Motoki M, Matsuo K, Nakamura H, Sawada M, Kuboyama S, Gonzalez MB, Simoen E, Eneman G, Claeys C |
2521 - 2523 |
Sub-threshold study of undoped trigate nFinFET Tettamanzi GC, Lansbergen GP, Paul A, Lee S, Deosarran PA, Collaert N, Klimeck G, Biesemans S, Rogge S |
2524 - 2527 |
Deep level transient spectroscopy study for the development of ion-implanted silicon field-effect transistors for spin-dependent transport Johnson BC, McCallum JC, van Beveren LHW, Gauja E |
2528 - 2530 |
Ultra-shallow junctions formed by quasi-epitaxial growth of boron and phosphorous-doped silicon films at 175 degrees C by rf-PECVD Labrune M, Moreno M, Cabarrocas PRI |
2531 - 2537 |
Ternary GeSiSn alloys: New opportunities for strain and band gap engineering using group-IV semiconductors D'Costa VR, Fang YY, Tolle J, Kouvetakis J, Menendez J |
2538 - 2541 |
Fabrication of high quality Ge virtual substrates by selective epitaxial growth in shallow trench isolated Si (001) trenches Wang G, Loo R, Takeuchi S, Souriau L, Lin JC, Moussa A, Bender H, De Jaeger B, Ong P, Lee W, Meuris M, Caymax M, Vandervorst W, Blanpain B, Heyns MM |
2542 - 2545 |
Synthesis of strained SiGe on Si(100) by pulsed laser induced epitaxy Kociniewski T, Fossard F, Boulmer J, Bouchier D |
2546 - 2550 |
Single-crystalline Si grown on single-crystalline Gd2O3 by modified solid-phase epitaxy Fissel A, Dargis R, Bugiel E, Schwendt D, Wietler T, Krugener J, Laha A, Osten HJ |
2551 - 2554 |
Non-melting annealing of silicon by CO2 laser Florakis A, Verrelli E, Giubertoni D, Tzortzis G, Tsoukalas D |
2555 - 2561 |
Comparison of the top-down and bottom-up approach to fabricate nanowire-based Silicon/Germanium heterostructures Wolfsteller A, Geyer N, Nguyen-Duc TK, Das Anungo P, Zakharov ND, Reiche M, Erfurth W, Blumtritt H, Werner P, Gosele U |
2562 - 2564 |
Influence of O contamination and Au cluster properties on the structural features of Si nanowires Pecora EF, Irrera A, Priolo F |
2565 - 2568 |
Influence of the epitaxial growth and device processing on the overlay accuracy during processing of the d-DotFET Moers J, Gerharz J, Rinke G, Mussler G, Trellenkamp S, Grutzmacher D |
2569 - 2572 |
Structural study of Si1-xGex nanocrystals embedded in SiO2 films Pinto SRC, Kashtiban RJ, Rolo AG, Buljan M, Chahboun A, Bangert U, Barradas NP, Alves E, Gomes MJM |
2573 - 2575 |
Ordered Ge-dot arrays in a Si-waveguide for 1.5 mu m detectors Lavchiev V, Chen G, Jantsch W |