2003 - 2007 |
Residual stress in low pressure chemical vapor deposition SiNx films deposited from silane and ammonia Temple-Boyer P, Rossi C, Saint-Etienne E, Scheid E |
2008 - 2015 |
Plasma cleaning and nitridation of sapphire substrates for AlxGa1-xN epitaxy as studied by x-ray photoelectron diffraction Seelmann-Eggebert M, Zimmermann H, Obloh H, Niebuhr R, Wachtendorf B |
2016 - 2020 |
Application of a toroidal plasma source to TiN thin film deposition Zhang BC, Cross RC |
2021 - 2030 |
Plasma-deposited silicon oxide and silicon nitride films on poly(ethylene terephthalate) : A multitechnique study of the interphase regions Sobrinho ASD, Schuhler N, Klemberg-Sapieha JE, Wertheimer MR, Andrews M, Gujrathi SC |
2031 - 2036 |
Reactive ion etching for AlGaInP/GaInP laser structures Juang YZ, Su YK, Chang SJ, Huang DF, Chang SC |
2037 - 2041 |
Reactive ion etching of piezoelectric materials in CF4/CHF3 plasmas Leech PW |
2042 - 2046 |
Deposition and characterization of gold thin films on Si by CF4+O-2 gas microwave plasma Taniguchi Y, Shin-mura T |
2047 - 2056 |
Remote plasma etching of silicon nitride and silicon dioxide using NF3/O-2 gas mixtures Kastenmeier BEE, Matsuo PJ, Oehrlein GS, Langan JG |
2057 - 2064 |
Effects of wall recombination on the etch rate and plasma composition of an etch reactor Font GI, Boyd ID, Balakrishnan J |
2065 - 2072 |
Radial distributions of ion velocity, temperature, and density in ultrahigh-frequency, inductively coupled, and electron cyclotron resonance plasmas Nakano T, Samukawa S |
2073 - 2077 |
Reactive sputtered titanium carbide/nitride and diamondlike carbon coatings Deng JG, Braun M, Wei Y |
2078 - 2083 |
Influence of surface impurities on plasma-driven permeation of deuterium through nickel Hatano Y, Nakamura H, Furuya H, Sugisaki M |
2084 - 2092 |
Properties of various sputter-deposited Cu-N thin films Wang DY, Nakamine N, Hayashi Y |
2093 - 2098 |
Carbon nitride thin-film growth by pulsed laser deposition Chen MY, Murray PT |
2099 - 2107 |
Influence of reactor wall conditions on etch processes in inductively coupled fluorocarbon plasmas Schaepkens M, Bosch RCM, Standaert TEFM, Oehrlein GS, Cook JM |
2108 - 2114 |
Electrical impedance analysis and etch rate maximization in NF3/Ar discharges Langan JG, Rynders SW, Felker BS, Beck SE |
2115 - 2119 |
Chemical downstream etching of tungsten Blain MG, Jarecki RL, Simonson RJ |
2120 - 2124 |
Electrical and optical properties of amorphous fluorocarbon films prepared by plasma polymerization of perfluoro-1,3-dimethylcyclohexane Weber A, Pockelmann R, Klages CP |
2125 - 2131 |
Metal bonding during sputter film deposition Shimatsu T, Mollema RH, Monsma D, Keim EG, Lodder JC |
2132 - 2139 |
Kinetic energy distribution of nitrogen ions in an electron cyclotron resonance plasma Fan ZY, Newman N |
2140 - 2147 |
Molecular beam epitaxial growth of AlN single crystalline films on Si (111) using radio-frequency plasma assisted nitrogen radical source Yasutake K, Takeuchi A, Kakiuchi H, Yoshii K |
2148 - 2152 |
Distribution of species within an ethylene electron cyclotron resonance-microwave plasma Webb SF, Gaddy GA, Blumenthal R |
2153 - 2161 |
Inductively coupled plasma etch processes for NiMnSb Hong J, Caballero JA, Lambers ES, Childress JR, Pearton SJ |
2162 - 2172 |
Dually driven radio frequency plasma simulation with a three moment model Kim HC, Manousiouthakis VI |
2173 - 2176 |
Electron velocity distribution functions in a sputtering magnetron discharge for the ExB direction Sheridan TE, Goeckner MJ, Goree J |
2177 - 2186 |
Comparison of plasma chemistries for dry etching thin film electroluminescent display materials Lee JW, Pathangey B, Davidson MR, Holloway PH, Lambers ES, Davydov B, Anderson TJ, Pearton SJ |
2187 - 2197 |
Experiments on the plasma assisted chemical vapor deposition of copper Lakshmanan SK, Gill WN |
2198 - 2203 |
Determination of metal vapor ion concentration in an argon/copper plasma for ionized physical vapor deposition Foster JE, Wendt AE, Wang WW, Booske JH |
2204 - 2209 |
Inductively coupled plasma etching of bulk 6H-SiC and thin-film SiCN in NF3 chemistries Wang JJ, Lambers ES, Pearton SJ, Ostling M, Zetterling CM, Grow JM, Ren F, Shul RJ |
2210 - 2214 |
Effect of substrate bias on the properties of a-C : H films by direct current saddle-field plasma-enhanced chemical-vapor deposition Yoo YZ, Kim HG, Jang HK, Jeong YG, Kim G |
2215 - 2221 |
Role of oxygen in ion-enhanced etching of poly-Si and WSix with chlorine Kota GP, Coburn JW, Graves DB |
2222 - 2226 |
Surface productions of CF and CF2 radicals in high-density fluorocarbon plasmas Suzuki C, Sasaki K, Kadota K |
2227 - 2239 |
Simulations of BCl3/Cl-2/Ar plasmas with comparisons to diagnostic data Meeks E, Ho P, Ting AL, Buss RJ |
2240 - 2244 |
Role of the bias voltage during the deposition of thin tin oxide films by plasma assisted chemical vapor deposition Arefi-Khonsari F, Hellegouarc'h F, Amouroux J |
2245 - 2251 |
Challenges in electron cyclotron resonance plasma etching of LiNbO3 surface for fabrication of ridge optical waveguides Mitsugi N, Nagata H, Shima K, Tamai M |
2252 - 2256 |
Synchrotron radiation induced SiC formation on Si substrate employing methanol and H radical Ikeda M, Inayoshi M, Hori M, Goto T, Hiramatsu M, Hiraya A |
2257 - 2260 |
Application of target factor analysis and linear least squares fitting to extracting chemical information from Auger depth profiles of a Mo/Si thin multilayer system Morohashi T, Hoshi T, Nikaido H, Kudo M |
2261 - 2266 |
MgO(100) surface relaxation by symmetrized automated tensor low energy electron diffraction analysis Ferry D, Suzanne J, Panella V, Barbieri A, Van Hove MA, Biberian JP |
2267 - 2271 |
Studying low-pressure chemical vapor deposition a-Si : B alloys by optical spectroscopy Yang GR, Zhao YP, Tong BY |
2272 - 2276 |
Defect-associated photoluminescence and rapid thermal annealing effect on SiO2 films grown in the plasma phase Kim K |
2277 - 2280 |
High-quality Fe(001) single crystal films on MgO(001) substrates for electron spectroscopies Bertacco R, De Rossi S, Ciccacci F |
2281 - 2286 |
Microstructural characterization of ion assisted SiO2 thin films by visible and infrared ellipsometry Brunet-Bruneau A, Souche D, Fisson S, Van VN, Vuye G, Abeles F, Rivory J |
2287 - 2291 |
Optical properties of zirconia-yttria single crystal compounds by reflection electron energy loss spectroscopy Yubero F, Espinos JP, Gonzalez-Elipe AR |
2292 - 2294 |
Effect of fractal crystallization on the depositing sequence of a Pd/Ge thin film system Chen ZW, Zhang SY, Tan S, Hou JG, Zhang YH |
2295 - 2299 |
Delamination mechanism in relation to adhesion of cubic boron nitride Kim IH, Kim SH, Kim KB |
2300 - 2308 |
Electrical characterization of the p-Hg1-xZnxTe interface after anodic sulfidization treatments Rousiere O, Lemoine D, Quemerais A, Granger R, Rolland S, Triboulet R |
2309 - 2317 |
Operation and oxidation of thermionic dispenser cathodes studied by high resolution photoemission Bailey P, Cowie BCC, Norman D |
2318 - 2325 |
Soft x-ray photoelectron diffraction study of epitaxial InGaAs/GaAs(001) Proietti MG, Turchini S, Garcia J, Arsenio MC, Casado C, Martelli F, Prosperi T |
2326 - 2329 |
Growth and characterization of epitaxial fcc Fe wedges on diamond (100) Li DQ, Keavney DJ, Pearson J, Jiang JS, Bader SD, Keune W |
2330 - 2336 |
Metrology of sub-0.5 mu m silicon epitaxial films Chen WZ, Reif R |
2337 - 2344 |
Structural characteristics and hardness of zirconium carbide films prepared by tri-ion beam-assisted deposition He XM, Shu L, Li HB, Li HD, Lee ST |
2345 - 2349 |
Improved optical scheme for nonintrusive vapor density monitoring by atomic absorption spectroscopy Ray A, Majumdar A |
2350 - 2359 |
Photoreflectance spectroscopy investigation of two-dimensional cesium metallic clusters on GaAs(100) Paget D, Kierren B, Houdre R |
2360 - 2366 |
Piezoelectric, dielectric, and interfacial properties of aluminum nitride films Liufu D, Kao KC |
2367 - 2371 |
Onset of oscillations during growth on a vicinal surface Harris S |
2372 - 2375 |
Preparation of nearly oxygen-free AlN thin films by pulsed laser deposition He MQ, Cheng NQ, Zhou PZ, Okabe H, Halpern JB |
2376 - 2380 |
Molecular beam epitaxy and interface reactions of layered GaSe growth on sapphire (0001) Chegwidden S, Dai ZR, Olmstead MA, Ohuchi FS |
2381 - 2384 |
Thickness distribution in pulsed laser deposited PZT films Tyunina M, Wittborn J, Bjormander C, Rao KV |
2385 - 2394 |
Growth of SiC films via C-60 precursors and a model for the profile development of the silicon underlayer Levinson JA, Hamza AV, Shaqfeh ESG, Balooch M |
2395 - 2399 |
Growth and characterization of potassium-doped superfulleride thin films Swami N, You YJ, Thompson ME, Koel BE |
2400 - 2410 |
Influence of sticking coefficients on the behavior of sputtered atoms in an argon glow discharge : Modeling and comparison with experiment Bogaerts A, Naylor J, Hatcher M, Jones WJ, Mason R |
2411 - 2417 |
Microstructure and electronic properties of the refractory semiconductor ScN grown on Mg0(001) by ultra-high-vacuum reactive magnetron sputter deposition Gall D, Petrov I, Madsen LD, Sundgren JE, Greene JE |
2418 - 2422 |
Quantitative measurement of nodule formation in W-Ti sputtering Lo CF, Draper D |
2423 - 2428 |
Interfacial reaction effects in the growth of MgO on GaAs(001) by reactive molecular beam epitaxy Robey SW |
2429 - 2436 |
Structural coherence of sputtered Ni3Al/Ni multilayers Tixier S, Boni P, Van Swygenhoven H |
2437 - 2441 |
Structural change and heteroepitaxy induced by rapid thermal annealing of CaF2 films on Si(111) Mattoso N, Mosca DH, Schreiner WH, Mazzaro I, Teixeira SR, Macedo WAA, Martins MD |
2442 - 2447 |
PbTiO3 butter layer effects on the structural and electrical properties of Pb(Zr, Ti)O-3 thin films grown by sputtering on silicon substrates Velu G, Haccart T, Jaber B, Remiens D |
2448 - 2453 |
Control of structural, electrical properties of (Ba,Sr)TiO3/RuO2 thin films by the application of amorphous (Ba,Sr)TiO3 layer Paek SH, Lee KS, Seong JY, Choi DK, Kim BS, Park CS |
2454 - 2462 |
Consequences of three-dimensional physical and electromagnetic structures on dust particle trapping in high plasma density material processing discharges Hwang HH, Keiter ER, Kushner MJ |
2463 - 2465 |
Graphite growth influenced by crystallographic faces of Ni films Yudasaka M, Kikuchi R, Ohki Y, Yoshimura S |
2466 - 2479 |
Atomic force microscopy and ellipsometry study of the nucleation and growth mechanism of polycrystalline silicon films on silicon dioxide Basa C, Tinani M, Irene EA |
2480 - 2488 |
Pulsed electron-beam technology for surface modification of metallic materials Proskurovsky DI, Rotshtein VP, Ozur GE, Markov AB, Nazarov DS, Shulov VA, Ivanov YF, Buchheit RG |
2489 - 2494 |
Influences of ion energy on morphology and preferred orientation of chromium thin films prepared by ion beam and vapor deposition Kuratani N, Ebe A, Ogata K |
2495 - 2500 |
In situ growth of evaporated TiO2 thin films using oxygen radicals : Effect of deposition temperature Grahn JV, Linder M, Fredriksson E |
2501 - 2504 |
Preparation of (001) cube textured CeO2 buffer layers on rolling-textured substrates by ion beam assisted pulsed laser deposition Xiong XM, Wang RP, Zhou YL, Guo XX, Lu HB, Pan SH, Yang GZ, Liu CF, Wu X, Zhang XP, Zhou L |
2505 - 2509 |
Effect of bismuth on the ferroelectric properties of SrBi2Ta2O9 thin films deposited on Pt/SiO2/Si by a modified radio-frequency magnetron sputtering technique Yang CH, Yoon SG |
2510 - 2516 |
Nitridation of vacuum evaporated molybdenum films in H-2/N-2 mixtures Amazawa T, Oikawa H |
2517 - 2523 |
Surface characterization of thin films of tetrathiofulvalene 7,7,8,8-tetracyano-p-quinodimethane evaporated on NaCl(001) Fraxedas J, Caro J, Figueras A, Gorostiza P, Sanz F |
2524 - 2527 |
Helium sticking coefficient on cryopanels coated by activated carbon Ozdemir I, Perinic D |
2528 - 2538 |
Chemical and photochemical processes in sulfide passivation of GaAs(100) : In situ optical study and photoemission analysis Berkovits VL, Ulin VP, Paget D, Bonnet JE, L'vova TV, Chiaradia P, Lantratov VM |
2539 - 2545 |
Surface cleaning with hydrogen plasma for low-defect-density ZnSe homoepitaxial growth Ohno T, Ohki A, Matsuoka T |
2546 - 2552 |
Chemical alteration of the native oxide layer on InP(111) by exposure to hyperthermal atomic hydrogen Wolan JT, Hoflund GB |
2553 - 2555 |
Diamond-like bonds in amorphous hydrogenated carbon films induced by x-ray irradiation Sato F, Saito N, Hirano Y, Jayatissa AH, Takizawa K, Kawado S, Kato T, Sugiyama H, Kagoshima Y, Ando M |
2556 - 2561 |
Use of a new type of atomic hydrogen source for cleaning and hydrogenation of compound semiconductive materials Kagadei VA, Proskurovsky DI |
2562 - 2566 |
Synthesis and structure of Al clusters supported on TiO2(110) : A scanning tunneling microscopy study Lai X, Xu C, Goodman DW |
2567 - 2571 |
Surface modification of (100) n-GaAs by radio frequency hydrogen plasmas Sullivan JL, Saied SO, Layberry R, Cardwell MJ |
2572 - 2580 |
Observation of adsorption and reaction of NH3 on crystalline Al2O3 under steady-state conditions using external-reflection infrared spectroscopy Bermudez VM |
2581 - 2584 |
Temperature-programmed desorption study of the etching of Ni(110) with 2,4-pentanedione Nigg HL, Masel RI |
2585 - 2590 |
Heterogeneous reactions of NO2 on NaCl and Al2O3 particles Goodman AL, Miller TM, Grassian VH |
2591 - 2594 |
Electrical properties of (Pb,La)TiO3 thin films deposited by low pressure metal-organic chemical vapor deposition using solid delivery system Shin JC, Lee JM, Hong SK, Cho HJ, Kim KS, Hwang CS, Kim HJ |
2595 - 2603 |
Characteristic losses in metals : Al, Be, and Ni Madden HH, Landers R, Kleiman GG, Zehner DM |
2604 - 2607 |
Copper diffusion in amorphous germanium Doyle JP, Kuznetsov AY, Svensson BG |
2608 - 2613 |
Thermally induced processes in thin layers, obtained by coevaporation of TeO2 and Sn Podolesheva I, Platikanova V, Konstantinov I, Dimov V, Tarassov M |
2614 - 2618 |
General technological modeling method for the design of transparent conductive In2O3 electrodes Golan G, Axelevitch A, Rabinovitch E |
2619 - 2624 |
Boron incorporation with and without atomic hydrogen during the growth of doped layers on Si(100) Silvestre C, Thompson P, Jernigan G, Simons D |
2625 - 2631 |
Evaluation of the ion bombardment energy for growing diamondlike carbon films in an electron cyclotron resonance plasma enhanced chemical vapor deposition Kang DH, Ha SC, Kim KB, Min SH |
2632 - 2640 |
Study of the dynamics of point defects at Si(111)-7x7 surfaces with scanning tunneling microscopy Hwang IS, Lo RL, Tsong TT |
2641 - 2645 |
Efficiency improvement in low temperature metal-oxide-semiconductor solar cells by thin metal film deposition on photon receiving area Lee KC, Hwu JG |
2646 - 2652 |
Improved formation of silicon dioxide films in liquid phase deposition Huang CJ, Houng MP, Wang YH, Wang NF, Chen JR |
2653 - 2662 |
Ballistic electron emission microscopy studies on Au/CaF2/n-Si(111) heterostructures Sumiya T, Miura T, Tanaka S |
2663 - 2667 |
Analysis of GaAs properties under biaxial tensile stress Kim KS, Yang GM, Lee HJ |
2668 - 2677 |
Structure engineering for hillock-free pure aluminum sputter deposition for gate and source line fabrication in active-matrix liquid crystal displays Voutsas AT, Hibino Y, Pethe R, Demaray E |
2678 - 2682 |
Control of performance and stability of thin film diodes using chromium nitride contacts Mc Garvey B, Curran JE, Ford FA, Gale IG, Hewett J, Theobald M |
2683 - 2686 |
Hydrogen passivation at the Al/H : Si(111)-(1x1) interface Grupp C, Taleb-Ibrahimi A |
2687 - 2692 |
Mapping local susceptibility using a scanning coaxial write/read head Strom V, Rao KV |
2693 - 2697 |
Acquisition of clean ultrahigh vacuum using chemical treatment Tatenuma K, Uchida K, Itoh T, Momose T, Ishimaru H |
2698 - 2702 |
Collision cell containment of dense gas targets for high vacuum applications Ketsdever AD, Muntz EP |
2703 - 2710 |
Improvement of turbomolecular pumps for ultraclean, low-pressure, and high-gas-flow processing Ino K, Sekine K, Shibata T, Ohmi T, Maejima Y |
2711 - 2717 |
Achievement of extremely high vacuum in an electrolytically polished stainless steel vacuum chamber Watanabe S, Kurokouchi S, Kato S, Aono M |
2718 - 2721 |
Inner surface modification of 40Cr steel cylinder with a new plasma source ion implantation method Sun M, Yang SZ, Yao WQ |
2722 - 2724 |
Use of 2H-heptafluoropropane, 1-iodoheptafluoropropane, and 2-iodoheptafluoropropane for a high aspect ratio via etch in a high density plasma etch tool Karecki S, Pruette L, Reif R, Beu L, Sparks T, Vartanian V |
2725 - 2727 |
Heteroepitaxial growth of RuO2 thin films on alpha-Al2O3 substrates with CeO2 buffer layers by pulsed laser deposition Chen CL, Jia QX, Lu YC, Smith JL, Mitchell TE |
2728 - 2732 |
Decay length of the pressure dependent deposition rate for magnetron sputtering Drusedau TP, Lohmann M, Garke B |
2733 - 2734 |
Thermodynamic theory for preferred orientation in carbon and cubic BN McKenzie DR, Bilek MMM |
2735 - 2737 |
Rapid thermal annealing of reactive sputtered tantalum oxide films on GaAs in N2O atmosphere Eftekhari G |
2738 - 2741 |
High-performance x-ray detector for appearance potential spectroscopy Rangelov G, Ertl K, Passek F, Vonbank M, Bassen S, Reinmuth J, Donath M, Dose V |
2742 - 2743 |
Silicon oxycarbide formation on SiC surfaces and the SiC/SiO2 interface (vol A15, pg 1597, 1997) Onneby C, Pantano CG |