| 1 |
Self-Annealing Behavior of Electroplated Cu in Blind-Hole Structures
Yang CH, Lee YW, Lee CY, Chang CH, Ho CE
Journal of the Electrochemical Society, 166(13), D683, 2019 |
| 2 |
High-temperature stability of Au/Pd/Cu and Au/Pd(P)/Cu surface finishes
Ho CE, Hsieh WZ, Lee PT, Huang YH, Kuo TT
Applied Surface Science, 434, 1353, 2018 |
| 3 |
High-Speed Cu Electrodeposition and Reliability of Cu Pillar Bumps in High-Temperature Storage
Lee PT, Wu YS, Lee CY, Liu HC, Ho CE
Journal of the Electrochemical Society, 165(13), D647, 2018 |
| 4 |
Real-time study of electromigration in Sn Blech structure
Ho CE, Hsieh WZ, Yang CH, Lee PT
Applied Surface Science, 388, 339, 2016 |
| 5 |
Formation mechanism of pinholes in electroplated Cu films and its mitigation
Chen CC, Hsieh CH, Lee YW, Yang CH, Ho CE
Thin Solid Films, 596, 209, 2015 |
| 6 |
Abnormal depletion of Cu metallization pads in line-bump-line solder joints under electron current stressing
Ho CE, Yang CH, Chen CT, Chen BZ
Thin Solid Films, 596, 216, 2015 |
| 7 |
Electron backscatter diffraction characterization of blind hole fillings by electrolytic Cu deposition
Ho CE, Hsu LH, Chen CC, Lu MK
Thin Solid Films, 572, 232, 2014 |
| 8 |
Theoretical and experimental determination of Cu diffusivity in eutectic Sn-Ag system at 235-280 degrees C
Ho CE, Hsieh WZ, Liu CS, Yang CH
Thin Solid Films, 572, 238, 2014 |
| 9 |
Reliability evaluation on a submicron Ni(P) thin film for lead-free soldering
Ho CE, Fan CW, Wu WH, Kuo TT
Thin Solid Films, 529, 364, 2013 |
| 10 |
Field-emission transmission electron microscopy study of the reaction sequence between Sn-Ag-Cu alloy and an amorphous Pd(P) thin film in microelectronic packaging
Ho CE, Wang CC, Rahman MA, Lin YC
Thin Solid Films, 529, 369, 2013 |
