| 1 |
Wafer temperature measurements during dielectric etching in a MERIE etcher
Gabriel CT
Journal of Vacuum Science & Technology B, 20(4), 1542, 2002 |
| 2 |
Modeling and simulation of feature-size-dependent etching of metal stacks
Abdollahi-Alibeik S, Zheng J, McVittie JP, Saraswat KC, Gabriel CT, Abraham SC
Journal of Vacuum Science & Technology B, 19(1), 179, 2001 |
| 3 |
Integration of metal masking and etching for deep submicron patterning
Gabriel CT, Kim RY, Baker DC
Journal of Vacuum Science & Technology A, 18(4), 1420, 2000 |
| 4 |
Gate oxide damage: Testing approaches and methodologies
Gabriel CT
Journal of Vacuum Science & Technology A, 17(4), 1494, 1999 |
| 5 |
Minimizing Metal Etch Rate Pattern Sensitivity in a High-Density Plasma Etcher
Gabriel CT, Zheng J, Abraham SC
Journal of Vacuum Science & Technology A, 15(3), 697, 1997 |
| 6 |
Performance of Different Etch Chemistries on Titanium Nitride Antireflective Coating Layers and Related Selectivity and Microloading Improvements for Submicron Geometries Obtained with a High-Density Metal Etcher
Abraham SC, Gabriel CT, Zheng J
Journal of Vacuum Science & Technology A, 15(3), 702, 1997 |
| 7 |
Correlation of Antenna Charging and Gate Oxide Reliability
Gabriel CT, Nariani SR
Journal of Vacuum Science & Technology A, 14(3), 990, 1996 |
| 8 |
Papers from the 3rd International Workshop on Advanced Plasma Tools for Etching, Chemical-Vapor-Deposition, and Plasma Vapor-Deposition - Sources, Process-Control, and Diagnostics - 3-4 May 1995 Le-Baron-Hotel, San-Jose, California - Preface
Gabriel CT
Journal of Vacuum Science & Technology B, 14(1), 465, 1996 |
| 9 |
Control of Plasma Damage to Gate Oxide During High-Density Plasma Chemical-Vapor-Deposition
Bothra S, Gabriel CT, Lassig S, Pirkle D
Journal of the Electrochemical Society, 142(11), L208, 1995 |
| 10 |
Effect of Plasma Overetch of Polysilicon on Gate Oxide Damage
Gabriel CT, Mcvittie JP
Journal of Vacuum Science & Technology A, 13(3), 900, 1995 |
