| 초록 |
Die bonding materials of the semiconductor manufacturing process should have a melting point higher than the temperature of the wire bonding process. Conventional Au-based alloys are very expensive and Pb-based alloys are toxic. Therefore, they should be replaced with a low-cost and eco-friendly materials. In this study, we report a die attach process using backside metals with Ag/Sn/Ag sandwich structure. It has a low-temperature bonding process and rapid bonding. After die attach process, we investigated the interfacial structure by optical microscope and electron microscopes. |
