화학공학소재연구정보센터
홈 로그인 로그아웃 연락처 사이트맵
Journal of Industrial and Engineering Chemistry, Vol.16, No.4, 556-559, July, 2010
DOI10.1016/j.jiec.2010.03.022  Export Citation
A comparison of some imidazoles in the curing of epoxy resin
Young Rok Ham, Sun Hee Kim, Young Jae Shin1, Dong Ho Lee, Minhee Yang, Ji Hye Min, and Jae Sup Shin†
  • Department of Chemistry, Chungbuk National University, Cheongju, Chungbuk 361-763, Republic of Korea
  • 1Department of Electrical and Computer Engineering, Texas A&M University, College Station, TX 77843, USA
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An epoxy-imidazole resin system was used to form an anisotropic conducting film (ACF) for electronic equipment applications. In this study, the curing behaviors of an epoxy resin with imidazole, 2-methylimidazole, 2-ethylimidazole, 2-phenylimidazole, 1-methylimidazole, 2-ethyl-4(5)-methylimidazole, and 1-(2-cyanoethyl)-2-ethyl-4(5)-methylimidazole were investigated using differential scanning calorimetry (DSC), and the curing times were determined at 150 and 180 ℃. The polymerization mechanism for the epoxy resin with imidazoles was examined, and the DSC results matched the mechanism. 2-Methylimidazole exhibited the fastest reaction time among the imidazoles used in this study.
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