화학공학소재연구정보센터
홈 로그인 로그아웃 연락처 사이트맵
Macromolecular Research, Vol.17, No.6, 388-396, June, 2009
Export Citation
Preparation and Characterization of Surface Energy of BPDA-BAPP Polyimide
Kyung-Hoe Kim†, Yong-Gwon Kim, and Younghwan Kwon
  • Department of Chemical Engineering, Daegu University, Gyungbuk 712 -714, Korea
E-mail:
The surface properties (water sorption and repellency, adhesion) are closely related to the surface tension of polymer solids. The critical surface tension (γc) and surface tension (γs) of a polymer solid were estimated by the contact angle method by our quantitative imaging system. BPDA (3,3',4,4'-biphenyl tetracarboxylic dianhydride)-BAPP (1,3-Bis(4-aminophenoxy) propane) polyimide was successfully synthesized. The γc values were analyzed by a Zisman plot, a Young-Dupre-Good-Girifalco plot, and a log (1+cos θ) vs log γL plot. The γs value of BPDA-BAPE polyimide was evaluated using the geometric mean equation and our multiple regression analysis. The calculated values of γS^(d) (a dispersion component), γS^(p) (a polar component), γS^(h) (a hydrogen bonding component), and γS were 30.79, 9.32, 0.20, and 40.31 mN·m^(-1), respectively. The γS of BPDA-BAPP polyimide containing both a methylene group and an ether group was larger than that of the polyimide containing only a methylene group.
Keywords:solid surface tension;critical surface tension;imaging method;contact angle;polyimide.
  1. Ruska WS, Microelectronic Processing: An Introduction to the Manufacture of Integrated Circuits, McGraw-Hill, New York, 1987, pp 68-76
  2. Endo A, Takada M, Adachi K, Takasago H, Yada T, Onishl Y, J. Electrochem. Soc.: Solid-State Sci. Tech., 34, 2522 (1987)
  3. Mittal KL, Polyimides: synthesis, characterization, and applications, Plenum Press, New York (1984)
  4. Feger C, Khojasteh MM, Htoo MS, Advances in polyimide science and technology, Technomic Publications, Lancaster (1993)
  5. Sroog CE, J. Polym. Sci.: Macromol. Rev., 11, 161 (1979)
  6. Wilson AM, Use of Polyimides in VLSI fabrication, in Polyimides, 1st ed., Mittal KL, Ed., Plenum Press, New York, 1984, pp 715-733
  7. Wilson AM, Thin Solid Films, 83, 145 (1981)
  8. Sacher E, Susko JR, J. Appl. Polym. Sci., 26, 679 (1981)
  9. Ree M, Goldberg MJ, Czornyj G, Han HS, Gryte CC, Polym. Mater. Sci. Eng., 68, 126 (1993)
  10. Lee DH, Polym.(Korea), 11(3), 206 (1987)
  11. Belluchi F, Khamis I, Senturia SD, Lantanison RM, J. Electrochem. Soc., 137, 1778 (1990)
  12. Kim BS, Bae SH, Park YH, Kim JH, Macromol. Res., 15(4), 357 (2007)
  13. Mathews AS, Kim I, Ha CS, Macromol. Res., 15(2), 114 (2007)
  14. Lee HS, Roy A, Badami AS, McGrath JE, Macromol. Res., 15(2), 160 (2007)
  15. Han HS, Ph. D. Thesis, Columbia University, New York (1993)
  16. Denton DD, Day DR, Priore DF, Senturia SD, J. Electron. Mater., 14, 119 (1985)
  17. Melcher J, Deben Y, Arlt G, IEEE Elecrt. Insul., 24, 31 (1989)
  18. Sacherand E, Sucko JR, J. Appl. Polym. Sci., 23, 2355 (1979)
  19. Merrem HJ, Klug R, Hartner H, New Developments in Photosensitive Polyimide, in Polyimides, 2nd ed., Mittal KL, Ed., Plenum Press, New York, 1989, pp 919-931
  20. Tchangai E, Segui Y, Doukkali K, J. Appl. Polym. Sci., 38, 305 (1989)
  21. Jou JH, Huang R, Huang PT, Shen WP, J. Appl. Polym. Sci., 43, 857 (1991)
  22. Kwon Y, Kim KH, Macromol. Res., 14(4), 424 (2006)
  23. Ree M, Macromol. Res., 14(1), 1 (2006)
  24. Shin GJ, Chi JH, Zin WC, Chang T, Ree M, Jung JC, Polym.(Korea), 30(2), 97 (2006)
  25. Ree M, Shin TJ, Lee SW, Korea Polym. J., 9(1), 1 (2001)
  26. Ree M, Shin TJ, Park YH, Lee H, Chang T, Korea Polym. J., 7(6), 370 (1999)
  27. Goh WH, Kim K, Kim SI, Shin TJ, Tee M, Korea Polym. J., 6(3), 241 (1998)
  28. Han H, Ree M, Korea Polym. J., 5(3), 152 (1997)
  29. Fox HW, Zisman WA, J. Colloid Sci., 5, 514 (1950)
  30. Johnson RE, Dettre RH, J. Colloid Sci., 20, 73 (1965)
  31. Gaudin AM, Flotation, McGraw-Hill, New York, 1957, p. 163
  32. Adams AW, Shirley FP, Kunichika KT, J. Colloid Interf. Sci., 34, 461 (1970)
  33. Fort T, Patterson HT, J. Colloid Sci., 18, 217 (1963)
  34. Kitazaki Y, Hata TJ, J. Adhes. Soc. Jpn., 8, 131 (1972)
  35. Kano Y, Akiyama S, Polymer, 33, 1690 (1992)
  36. Fox HW, Zisman WA, J. Colloid Sci., 7, 109 (1952a)
  37. Fox HW, Zisman WA, J. Colloid Sci., 7, 428 (1952b), J. Colloid Sci., 7, 428 (1952)
  38. Zisman A, in Treaties on Contact Angle, Wettability and Adhesion, Advances in Chemistry Series, American Chemical Society, Washington DC, 1964, No. 43, pp 1-51
  39. Fowkes FM, in Treaties on Contact Angle, Wettability and Adhesion, Advances in Chemistry Series, American Chemical Society, Washington DC, 1964, No. 43, pp 99-111
  40. Good RJ, in Treaties on Contact Angle, Wettability and Adhesion, Advances in Chemistry Series, American Chemical Society, Washington DC, 1964, No. 43, pp 74-87
  41. Good RJ, in Treaties on Adhesion and Adhesive, Patrick RL, Ed., Marcel Dekker, New York, 1967, Vol. 1, pp 9-68
  42. Good RJ, Girifalco LA, J. Phys. Chem., 64, 561 (1960)
  43. Kano Y, Saito T, Setchaku, 32, 396 (1988)
  44. Wu S, Polymer Interface and Adhesion, Marcel Dekker, New York, 1982a, p 105
  45. Kaelble DH, Uy KC, J. Adhes., 2, 51 (1970)
  46. Wu S, Polymer Interface and Adhesion, Marcel Dekker, New York, 1982b, pp 257-259
  47. Adamson AW, Physical Chemistry of Surfaces, 5th ed., John Wiley & Sons, New York, 1990a, pp 389-392
  48. Ghosh MK, Mittal KL, Polyimides: Fundamentals and Applications, Marcel Dekker, New York, 1996, pp 16-18
  49. Wu S, Polymer Interface and Adhesion, Marcel Dekker, New York, 1982c, p. 162
  50. Wu S, Polymer Interface and Adhesion, Marcel Dekker, New York, 1982d, p. 183
  51. Adamson AW, Physical Chemistry of Surfaces, 5th ed., John Wiley & Sons, New York, 1990b, pp 397-398
  52. Gutowski W, J. Adhes., 19, 29 (1985)
  53. Kim KH, Kwon Y, J. Chem. Eng. Jpn., 38(8), 641 (2005)
  54. Kim KH, Kim YG, Kwon Y, Mol. Cryst. Liq. Cryst., 470, 145 (2007)
  55. Brandrup J, Immergut EH, Polymer Handbook, 3rd ed., Wiley-Interscience, John Wiley & Sons, New York, 1989, p VI/422