Polymer(Korea), Vol.32, No.6, 580-586, November, 2008
투명한 폴리이미드 공중합체 필름의 합성과 특성 연구 (I)
Synthesis and Characterization of Transparent Copolyimide Films (I)
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초록
4,4’-(Hexafluoroisopropylidene)diphthalic anhydride(6FDA)와 1,3-bis(3-aminophenoxy)
benzene(BAPB)의 조성에 2,2-bis[4-(4-aminophenoxy)phenyl] hexafluoropropane(BAPP)를 다양한 몰 비에 따른 폴리이미드(PI) 공중합체를 합성하였다. PI 공중합체 필름들은 여러 열처리 과정을 통하여 용액 캐스팅(solution casting)된 폴리아믹산(PAA)으로부터 얻었다. 퓨리에 변환 적외선 분광기(FT-IR), 넓은 각 X-선 회절(XRD), 전계 방사형 주사 전자 현미경(FE-SEM), 시차주사 열량계(DSC)와 열 중량 분석기(TGA), 만능 인장 시험기(UTM) 그리고 자외선-가시광선 흡광도기(UV-Vis. spectrometer) 등을 사용하여 PI 공중합체 필름의 열적·기계적 성질, 모폴로지 및 광학 투명도를 측정하였다. PI 공중합체 필름의 유리전이온도 및 최종 강도와 초기 탄성률은 BAPP의 몰 비가 증가할수록 증가하였으나, 초기분해온도는 BAPP의 몰 비 증가에 무관하게 일정하였다. BAPP가 charge transfer complex를 형성하는 이유로 BAPP 농도가 증가함에 따라 PI 공중합체 필름의 투명도는 약간씩 감소하였다.
Copolyimides were synthesized from 4,4′-(hexafluoroisopropylidene)diphthalic anhydride
(6FDA) and 1,3-bis(3-aminophenoxy)benzene (BAPB) with different mole ratios of 2,2-bis[4-(4-
aminophenoxy)phenyl]hexafluoropropane (BAPP). The solution cast film of poly(amic acid)(PAA) was heat treated at different temperatures to create copolyimide films. The PI copolymer films were found to exhibit good optical transparencies. The thermomechanical properties, morphology, and optical transparency of PI films were examined using fourier transform infrared spectroscopy(FT-IR), wide-angle X-ray diffraction (XRD), scanning electron microscopes(SEM), differential scanning calorimeter(DSC), thermogravimetric analyzer(TGA), universal tensile machine(UTM), and UV-Vis. spectrometer. The glass transition temperature(Tg), ultimate strength, and initial modulus linearly increased with increasing BAPP mole fraction. However, thermal stability(TDi) of the copolyimide remains constant regardless of BAPP loadings. It was found, however, that the optical transparency decreases slightly upon increasing the BAPP content because of the formation of the charge transfer complexes.
- Ma SL, Kim YS, Lee JH, Kim JS, KIm I, Won JC, Polym.(Korea), 29(2), 204 (2005)
- Shim JC, Choi SM, Sim HB, Kwon SH, Yi MH, Polym.(Korea), 28(6), 494 (2004)
- Wilson D, Stenzenberger HD, Hergenrother PM, Polyimide, Blackie and Sons, Glasgow, 1991
- Ghosh MK, Mittal KL, Ed., Polyimide: Synthesis, Characterization and Applications, Marcel Dekker, New York, Vol. 1 and 2 (1984)
- Satou H, Makino D, Polyimides for Electric Applications, Hitachi Chemical Co., Ltd., Ibaraki, 1993
- Tyan HL, Leu CM, Wei KH, Chem. Mater., 13, 222 (2001)
- Liaw DJ, Liaw BY, Su KL, Polym. Adv. Technol., 10, 13 (1999)
- Hergenrother PM, Watson KA, Smith JG, Connell JW, Yokota R, Polymer, 43(19), 5077 (2002)
- Xu JW, Chng ML, Chung TS, He CB, Wang R, Polymer, 44(16), 4715 (2003)
- Dupont BS, Bilow N, US Pat., 4, 592925 (1986)
- Landis AL, Naselow AB, US Pat., 4, 645824 (1987)
- Higashi K, Noda Y, Eur Pat. 240-249 (1986)
- Matsuura T, Ando S, Sasaki S, Yamamoto F, Electron. Lett., 29, 2107 (1993)
- Jin HS, Chang JH, J. Appl. Polym. Sci., 107, 109 (2008)
- Yi MH, Polym. Sci. Technol., 18(1), 26 (2007)
- Yang CY, Hsu SLC, Chen JS, J. Appl. Polym. Sci., 98(5), 2064 (2005)
- Ree M, Shin TJ, Kim SI, Woo SH, Yoon DY, Polymer, 39(12), 2521 (1998)
- Kim SU, Lee C, Sundar S, Jang WB, Yang SJ, Han H, J. Polym. Sci. B: Polym. Phys., 42(23), 4303 (2004)
- Ree M, Yoon DY, Volksen W, Polym. Prepr., 31, 613 (1990)
- Rojstaczer S, Ree M, Yoon DY, Volksen W, J. Polym. Sci. Part B: Polym. Phys., 30, 133 (1991)
- Niwa M, Nagaoka S, Kawakami H, J. Appl. Polym. Sci., 100(3), 2436 (2006)
- Jin HS, Chang JH, Polym.(Korea), 32(3), 256 (2008)
- Yi MH, Choi KY, Polym. Sci. Tech., 11, 741 (2002)
- Ju CH, Kim JC, Chang JH, J. Appl. Polym. Sci., 106(6), 4192 (2007)
- Chang JH, Park KM, Polym. Eng. Sci., 41(12), 2226 (2001)
- Petrovic ZS, Javni I, Waddon A, Banhegyi G, J. Appl. Polym. Sci., 76(2), 133 (2000)
- Zhu ZK, Yang Y, Yin J, Wang XY, Ke YC, Qi ZN, J. Appl. Polym. Sci., 3, 2063 (1999)
- Fukukawa KI, Shibasaki Y, Ueda M, Polym. Adv. Technol., 17, 131 (2006)
- Qian ZG, Ge ZY, Li ZX, He MH, Liu JG, Pang ZZ, Fan L, Yang SY, Polymer, 43(22), 6057 (2002)