The influence of CO on the passive behavior of copper was analyzed in the potential region near the rest potential in borax solutions (pH 9.2) by cyclic voltammetry, ellipsometry, and surface charge determination techniques. The oxide formation is explained as a sequence Of Cu2O growth, cation adsorption, Cu(II), and dissolution steps, similarly to previously reported investigations for the metal in free CO solutions. The CO adsorption hinders the cationic defect in the outer oxide layer and accelerates the Cu2O growth both at open circuit and in controlled potential experiments. The isoelectric point, iep, obtained at pH 10.8 for both the metal Cu and CuO particles in KCl solutions shifts to pH 10.1 for copper particles in the presence of CO. The iep indicates a CuO coating on Cu metallic particles in the absence of CO. (C) 2003 Elsevier Inc. All rights reserved.