The rapid introduction of copper metallization for semiconductor devices has prompted increased research into focused-ion-beam micromachining of copper. Studies with the aim of increasing the material removal rate of Cu by focused-ion-beam micromachining have been complicated by variable micromachining behavior apparently resulting from differing Cu film morphologies produced by the various Cu deposition procedures. This work examined the micromachining behavior of thin copper films produced by physical-vapor deposition (PVD) and electroplating, as well as single-crystal copper samples. PVD copper films were found to be preferentially textured along (111), with a columnar grain structure. Channeling effects within this type of grain structure provide a geometric enhancement of the material removal rate of 30% when the sample normal is tilted 12 degrees from the incident ion beam, regardless of sample rotation. Single-crystal (111) copper was found to exhibit similar material removal rate enhancement (averaged over 360 degrees rotation) when tilted 12 degrees, verifying that the etching enhancement observed in the PVD films is directly related to their (111) texture. Compared to the PVD film, electroplated (EP) copper thin films contained a significantly more random grain orientation. Consequently, the EP films did not exhibit any appreciable variation in material removal rate beyond the expected cosine dependence when tilted with respect to the incident Ga+ beam normal. Micromachining of the electroplated films, which have larger randomly oriented grains, results in grain decoration due to preferential etching producing severe micromachining-induced topography.