Previous Article Next Article Table of Contents Journal of Vacuum Science & Technology B, Vol.13, No.2, 203-208, 1995 DOI10.1116/1.587998 Export Citation Directional Deposition of Cu into Semiconductor Trench Structures Using Ionized Magnetron Sputtering Cheng PF, Rossnagel SM, Ruzic DN Please enable JavaScript to view the comments powered by Disqus.
