화학공학소재연구정보센터
Journal of the Electrochemical Society, Vol.143, No.6, 1978-1983, 1996
Microstructure of Electrodeposited Cu-Ni Binary Alloy-Films
The codeposition of Cu and Ni in the electrodeposition method without a complexing agent is difficult, since the standard electrode potentials of Cu and Ni differ by approximately 600 mV. In this study, the electrodeposited Cu-Ni alloy films with various compositions were obtained using glycine as the complexing agent. Consequently; composition of the deposited Cu-Ni alloy films can be controlled by bath composition and pH, and the crystallographic structure of all the deposited Cu-Ni alloy films consists of a single solid solution and is not influenced by pH.