고분자철연재료에서 전기트리 열화벚 철연파괴 현상

조영신; 김상욱; Y. S. Cho; S.W. Kim

Korean Journal of Materials Research, Vol.9, No.4, 398-403, April, 1999

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고분자철연재료에서 전기트리 열화벚 철연파괴 현상

Electrical Treeing Deterioration and Dielectric Breakdown Phenomena in Polymeric Insulator

조영신, 김상욱

서울시립대학교 화학공학과

Y. S. Cho, and S.W. Kim

Dept. of Chem. Eng., The Univ. of Seoul, Seoul 130-743, Korea

초록

폴리에틸렌과 에폭시 수지계 고분자 절연재료에서 발생하는 전기트리 열화 및 절연파괴 현상에 대해 연구하였다. 침평판전극구조를 갖는 블럭상 시편에 전기적 응력을 가하고 침 선단에서 발생하는 전기트리를 관찰하였다. 저밀도 폴리에틸렌에서 발생하는 전기트리 형상은 밀도가 매우 높은 부시상이었으며， 가교 폴리에틸렌에서는 가지형 전기트리가 관찰되었다. 에폭시 수지에서는 첨가제 SN 의 함량과 온도가 증가함에 따라 절연파괴 강도는 감소하였으며 전기트리는 더욱 복잡해졌다. 가교밀도가 높아 딱딱한 DGEBA/MDA 에폭시 수지계에서는 전도성 트리 경로 주위에 일련의 부채꼴 크랙이 관찰되었다.

Studies on the electrical treeing deterioration and dielectric breakdown phenomena in the polymeric insulator of polyethylene and epoxy resin were carried out. Block type samples with needle-plane electrode geometry were electrically stressed and the tree pattern from the needle tip was observed. In LDPE the density of electrical tree was very high and its pattern was bush type. For the case of XLPE, branched tree was observed. As temperature and SN content increased, the dielectric breakdown voltage decreased and the treeing phenomena became more complicated. Fan type cracks were observed around the conducting tree path in the brittle DGEBA/MDA system.

Keywords:Dielectric;breakdown;electrical tree;deterioration;epoxy resin;LDPE;XLPE

[References]

Shim MJ, Kim SW, Polym. J., 30(2), 73 (1998)
Lee JY, Shim MJ, Kim SW, Polymer Eng. & Sci., in press.
Maruyama S, Kobayaslu S, Kudo K, T.lEE Japan, 113-A(6), 480 (1993)
Kim JS, Lee SK, Choi WS, Park GH, Lee JD, ’96. IEEE ISEIM, Quebec, Canada, 573 (1996).
Lu M, Kim SW, J. Appl. Polym. Sci., 73, 2401 (1999)
Champion JV, Dodd SJ, Alison JM, J. Phys. D-Appl. Phys., 29, 2689 (1996)
Champion JV, Dodd SJ, Stevens GC, ibid., 27, 1020 (1994)
Cho YS, Shim MJ, Kim SW, Mater. Chem. Phys., 56, 87 (1998)
Cho YS, Slum MJ, Kim SW, ibid., 52, 94 (1998)
Lee JY, Shim MJ, Kim SW, Polimery, 43, 685 (1998)
Ieda M, Nawata M, IEEE TEI, EI-12(1), 10 (1977)
Fothergill JC, Dissado LA, Sweeney PJJ, IEEE TDEI, 1(3), 474 (1994)
Cho YS, Park JH, Shim MJ, Kim SW, ’98. IEEE CEIDP, Atlanta, 140 (1998).
Cho YS, Lee SH, Lee HK, Shim MJ, Lee JS, Kim SW, HNTTI’96, Dandong, China, 755 (1996).

[Referenced By]

[1] Shim MJ, Kim SW, Polym. J., 30(2), 73 (1998)

[2] Lee JY, Shim MJ, Kim SW, Polymer Eng. & Sci., in press.

[3] Maruyama S, Kobayaslu S, Kudo K, T.lEE Japan, 113-A(6), 480 (1993)

[4] Kim JS, Lee SK, Choi WS, Park GH, Lee JD, ’96. IEEE ISEIM, Quebec, Canada, 573 (1996).

[5] Lu M, Kim SW, J. Appl. Polym. Sci., 73, 2401 (1999)

[6] Champion JV, Dodd SJ, Alison JM, J. Phys. D-Appl. Phys., 29, 2689 (1996)

[7] Champion JV, Dodd SJ, Stevens GC, ibid., 27, 1020 (1994)

[8] Cho YS, Shim MJ, Kim SW, Mater. Chem. Phys., 56, 87 (1998)

[9] Cho YS, Slum MJ, Kim SW, ibid., 52, 94 (1998)

[10] Lee JY, Shim MJ, Kim SW, Polimery, 43, 685 (1998)

[11] Ieda M, Nawata M, IEEE TEI, EI-12(1), 10 (1977)

[12] Fothergill JC, Dissado LA, Sweeney PJJ, IEEE TDEI, 1(3), 474 (1994)

[13] Cho YS, Park JH, Shim MJ, Kim SW, ’98. IEEE CEIDP, Atlanta, 140 (1998).

[14] Cho YS, Lee SH, Lee HK, Shim MJ, Lee JS, Kim SW, HNTTI’96, Dandong, China, 755 (1996).