Characterization of the Cure for DGEBA/MDA with GN

In-Sook Chun; Mi-Ja Shim; Sang-Wook Kim

Journal of Industrial and Engineering Chemistry, Vol.1, No.1, 36-41, December, 1995

In-Sook Chun, Mi-Ja Shim¹, and Sang-Wook Kim

Dept. of Chem. Eng., Seoul City Univ., Seoul 130-743, Korea
¹Dept. of Life Sci., Seoul City Univ., Seoul 130-743, Korea

To obtain the complete description of cure reaction for diglycidyl ether of bisphenol A(DGEBA)/4,4′-methylene dianiline(MDA)/glutaronitrile(GN), cure reaction and cure kinetics were investigated by DSC(differential scanning calorimetry) dynamic run. Thermal and mechanical properties were also estimated for the purpose of high-performance use. In study of cure kinetics by means of Barrett method and Integral method, the overall reaction order was second and pre-exponential factor decreased with increasing heating rate. From the residual enthalpy(ΔH_R) scanned in DSC with samples cured isothermally for various periods of time, the conversion (or degree of cure) could be calculated. Tg was increased with increasing the cure temperature and was lowered by adding GN, which caused chain extension resulting from the formation of amino group(-C(=O)-NH-) and rendered more flexibility to the system. By decreasing ether crosslinkage, impact strength was enhanced. With GN content increased, tensile strength decreased. Consequently, mechanical strength of the DGEBA/MDA/GN system positioned within the desirable area with proper toughness and stiffness.

[References]

Prime RB, Thermal Characterization of Polymeric Materials, Ed. A. Turi, Academic Press, New York (1982)
Dusek K, Epoxy Resins and Composites II, Springer, New York (1986)
Lee H, Neville K, Handbook of Epoxy Resins, McGraw-Hill, New York (1967)
Browing CE, Polym. Eng. Sci., 18, 16 (1978)
Sourour S, Kamal MR, Thermochim. Acta, 14, 41 (1976)
Peyser P, Bascom WD, J. Appl. Polym. Sci., 21, 2359 (1977)
Lee JY, Shim MJ, Kim SW, Proc. IUMRS-ICA-'94, 699, Taiwan (1994)
Lee JY, Shim MJ, Kim SW, Mater. Chem. Phys., 44, 74 (1996)
Manzione LT, Gillham JK, McPherson CA, J. Appl. Polym. Sci., 26, 889 (1981)
Osinski JS, Polym. Eng. Sci., 23, 756 (1983)
Cuadrado TR, Borrajo J, Williams RJJ, J. Appl. Polym. Sci., 28, 485 (1983)
Chun IS, Shim MJ, Kim SW, J. Korean Ind. Eng. Chem., 5(6), 967 (1994)
Chun IS, Shim MJ, Kim SW, J. Korean Ind. Eng. Chem., 6(1), 35 (1995)
Chun IS, Shim MJ, Kim SW, J. Korean Mater. Res., 4, 574 (1994)
Adabbo HE, Williams RJJ, J. Appl. Polym. Sci., 27, 1327 (1982)
Mijovic J, Kim J, Slaby J, J. Appl. Polym. Sci., 29, 1449 (1984)
Riccardi CC, Adabbo HE, Williams RJJ, J. Appl. Polym. Sci., 29, 2481 (1984)
Horie K, Hiura H, Sawada M, Mita I, Kambe H, J. Polym. Sci. A: Polym. Chem., 1, 1357 (1970)
Chern CS, Poehlein GW, Polym. Eng. Sci., 27, 788 (1987)
Keenan MR, J. Appl. Polym. Sci., 33, 1725 (1987)
Fox TG, Loshaek S, J. Polym. Sci., 15, 371 (1955)

[Referenced By]

[1] Prime RB, Thermal Characterization of Polymeric Materials, Ed. A. Turi, Academic Press, New York (1982)

[2] Dusek K, Epoxy Resins and Composites II, Springer, New York (1986)

[3] Lee H, Neville K, Handbook of Epoxy Resins, McGraw-Hill, New York (1967)

[4] Browing CE, Polym. Eng. Sci., 18, 16 (1978)

[5] Sourour S, Kamal MR, Thermochim. Acta, 14, 41 (1976)

[6] Peyser P, Bascom WD, J. Appl. Polym. Sci., 21, 2359 (1977)

[7] Lee JY, Shim MJ, Kim SW, Proc. IUMRS-ICA-'94, 699, Taiwan (1994)

[8] Lee JY, Shim MJ, Kim SW, Mater. Chem. Phys., 44, 74 (1996)

[9] Manzione LT, Gillham JK, McPherson CA, J. Appl. Polym. Sci., 26, 889 (1981)

[10] Osinski JS, Polym. Eng. Sci., 23, 756 (1983)

[11] Cuadrado TR, Borrajo J, Williams RJJ, J. Appl. Polym. Sci., 28, 485 (1983)

[12] Chun IS, Shim MJ, Kim SW, J. Korean Ind. Eng. Chem., 5(6), 967 (1994)

[13] Chun IS, Shim MJ, Kim SW, J. Korean Ind. Eng. Chem., 6(1), 35 (1995)

[14] Chun IS, Shim MJ, Kim SW, J. Korean Mater. Res., 4, 574 (1994)

[15] Adabbo HE, Williams RJJ, J. Appl. Polym. Sci., 27, 1327 (1982)

[16] Mijovic J, Kim J, Slaby J, J. Appl. Polym. Sci., 29, 1449 (1984)

[17] Riccardi CC, Adabbo HE, Williams RJJ, J. Appl. Polym. Sci., 29, 2481 (1984)

[18] Horie K, Hiura H, Sawada M, Mita I, Kambe H, J. Polym. Sci. A: Polym. Chem., 1, 1357 (1970)

[19] Chern CS, Poehlein GW, Polym. Eng. Sci., 27, 788 (1987)

[20] Keenan MR, J. Appl. Polym. Sci., 33, 1725 (1987)

[21] Fox TG, Loshaek S, J. Polym. Sci., 15, 371 (1955)