1 - 5 |
Undercut structure fabricated by complementary-structure micropatterning technique for the passive-matrix display of organic light-emitting diodes Xing R, Xuan Y, Ma DG, Han YC |
6 - 10 |
Fabrication and performance of nanoscale ultrasmooth programed defects for extreme ultraviolet lithography Olynick DL, Salmassi F, Liddle JA, Mirkarimi PB, Spiller E, Baker SL, Robinson J |
11 - 22 |
Studies of fluorocarbon film deposition and its correlation with etched trench sidewall angle by employing a gap structure using C4F8/Ar and CF4/H-2 based capacitively coupled plasmas Ling L, Hua X, Zheng L, Oehrlein GS, Hudson EA, Jiang P |
23 - 27 |
Mobility-diffusivity relationship for semiconductor nanowires Khan A, Mohammad SN |
28 - 31 |
Double oxidation scheme for tunnel junction fabrication Holmqvist T, Meschke M, Pekola JP |
32 - 35 |
Turn-on field distribution of field-emitting sites in carbon nanotube film: Study with luminescent image Liu WH, Zeng FG, Xin L, Zhu CC, He YN |
36 - 40 |
Exposure latitude of deep-ultraviolet conformable contact photolithography Fucetola CP, Carter DJD, Goodberlet JG |
41 - 46 |
Structural and electrical investigation of laser annealed (Pb,Sr)TiO3 thin films Wang JL, Lai YS, Liou SC, Chiou BS, Jan CK, Cheng HC |
47 - 51 |
Enhanced local oxidation of silicon using a conducting atomic force microscope in water Hilton AM, Jacobson KW, Lynch BP, Simpson GJ |
52 - 55 |
Optical properties of n-doped Ga1-xMnxN epitaxial layers grown by metal-organic chemical-vapor deposition in mid and far (5-50 mu m) IR range Weerasekara AB, Hu ZG, Dietz N, Perera AGU, Asghar A, Kane MH, Strassburg M, Ferguson IT |
56 - 61 |
GaSb based midinfrared equilateral-triangle-resonator semiconductor lasers Yu SQ, Cao Y, Johnson SR, Zhang YH, Huang Y |
62 - 66 |
Grayscale lithography by a polymer photomask doped with laser dye Korivi NS, Zhou YX, Jiang L |
67 - 71 |
Improvement of the wiggling profile of spin-on carbon hard mask by H-2 plasma treatment Tadokoro M, Yonekura K, Yoshikawa K, Ono Y, Ishibashi T, Hanawa T, Fujiwara N, Matsunobe T, Matsuda K |
72 - 75 |
Nonlocal reduced boron diffusivity in silicon below strained Si1-xGex surfaces Carroll MS, Suh YS, Levy R |
76 - 79 |
Nanostructuring GaN using microsphere lithography Ng WN, Leung CH, Lai PT, Choi HW |
80 - 83 |
Flare-variation compensation for 32 nm line and space pattern for device manufacturing on extreme-ultraviolet lithography Aoyama H, Iriki N, Tanaka T |
84 - 88 |
Potential of phase-shifted optical proximity correction for 65 nm T-shaped pattern in high numerical aperture lithography Gao SB, Li YQ |
89 - 95 |
Atomic diffusion and interface electronic structure at In0.49Ga0.51P/GaAs heterojunctions Smith PE, Lueck M, Ringel SA, Brillson LJ |
96 - 101 |
Study of pretreatment prior to silicon-oxycarbide deposition on Cu interconnect Huang CC, Huang JL, Wang YL, Lo KY |
L1 - L6 |
Recent advance in protection technology for extreme ultraviolet lithography masks under low-pressure condition Kim JH |
L7 - L9 |
Boron nanobelts grown under intensive ion bombardment Li WT, Boswell R, Gerald JDF |
102 - 105 |
Surface structure characterization of nanodiamond thin film for electronic field emission applications Xie FY, Xie WG, Chen J, Liu X, Lu DY, Zhang WH |
106 - 109 |
Study of high-brightness flat-panel lighting source using carbon-nanotube cathode Zhang Y, Deng SZ, Duan CY, Chen J, Xu NS |
110 - 116 |
Effective energy densities in KrF excimer laser reformation as a sidewall smoothing technique Liang EZ, Hung SC, Hsieh P, Lin CF |
117 - 121 |
Facet formation and lateral overgrowth of selective Ge epitaxy on SiO2-patterned Si(001) substrates Park JS, Bai J, Curtin M, Carroll M, Lochtefeld A |
122 - 127 |
Fabrication of silicon kinoform lenses for hard x-ray focusing by electron beam lithography and deep reactive ion etching Stein A, Evans-Lutterodt K, Bozovic N, Taylor A |
128 - 131 |
Photoresist characterization using double exposures with interference lithography O'Reilly TB, Smith HI |
132 - 136 |
Novel hydrostatic pressuring mechanism for soft UV-imprinting processes Cheng FS, Yang SY, Chen CC |
137 - 140 |
Analysis of temperature-dependent barrier heights in erbium-silicided Schottky diodes Jun M, Jang M, Kim Y, Choi C, Kim T, Oh S, Lee S |
141 - 150 |
Effect of temperature on copper damascene chemical mechanical polishing process Kakireddy VR, Mudhivarthi S, Kumar A |
151 - 155 |
Patterned wafer defect density analysis of step and flash imprint lithography McMackin I, Martin W, Perez J, Selinidis K, Maltabes J, Xu F, Resnick D, Sreenivasan SV |
156 - 158 |
Soft photocurable nanoimprint lithography for compound semiconductor nanostructures Meneou K, Cheng KY |
159 - 163 |
Electrical conductivity of ultra-thin silicon nanowires Rochdi N, Tonneau D, Jandard F, Dallaporta H, Safarov V, Gautier J |
164 - 170 |
Erbium silicide formation and its contact properties on Si(100) Huang W, Ru GP, Jiang YL, Qu XP, Li BZ, Liu R, Lu F |
171 - 174 |
Luminescence uniformity studies on dendrite bamboo carbon submicron-tube field-emitter arrays Li X, Ding FQ, Liu WH, He YN, Zhu CC |
175 - 180 |
Structural and electrical studies of conductive nanowires prepared by focused ion beam induced deposition Reguer A, Bedu F, Tonneau D, Dallaporta H, Prestigiacomo M, Houel A, Sudraud P |
181 - 188 |
Plasma reactor dry cleaning strategy after TiN, TaN and HfO2 etching processes Ramos R, Cunge G, Joubert O |
189 - 194 |
Hybrid nanofabrication processes utilizing diblock copolymer nanotemplate prepared by self-assembled monolayer based surface neutralization Kim SJ, Maeng WJ, Lee SK, Park DH, Bang SH, Kim H, Sohn BH |
195 - 200 |
Measurements of local optical properties of Si-doped GaAs (110) surfaces using modulation scanning tunneling microscope cathodoluminescence spectroscopy Watanabe K, Nakamura Y, Ichikawa M |
201 - 205 |
Inelastic deformability of nanopillar by focused-ion-beam chemical vapor deposition Shibutani Y, Yoshioka T |
206 - 208 |
Fabrication of single-crystalline LiTaO3 film on silicon substrate using thin film transfer technology Liu WL, Zhan D, Ma XB |
209 - 213 |
Description of field emission current/voltage characteristics in terms of scaled barrier field values (f-values) Forbes RG |
214 - 218 |
Low-temperature c-axis oriented growth of nanocrystalline ZnO thin films on Si substrates by plasma assisted pulsed laser deposition Shao J, Shen YQ, Sun J, Xu N, Yu D, Lu YF, Wu JD |
219 - 226 |
Mechanistic study of plasma damage of low k dielectric surfaces Bao J, Shi H, Liu J, Huang H, Ho PS, Goodner MD, Moinpour M, Kloster GM |
227 - 231 |
Surface plasmon assisted contact scheme nanoscale photolithography using an UV lamp Shao DB, Chen SC |
232 - 243 |
Low energy electron-excited nanoscale luminescence spectroscopy studies of intrinsic defects in HfO2 and SiO2-HfO2-SiO2-Si stacks Strzhemechny YM, Bataiev M, Tumakha SP, Goss SH, Hinkle CL, Fulton CC, Lucovsky G, Brillson LJ |
244 - 248 |
Novel photocurable epoxy siloxane polymers for photolithography and imprint lithography applications Wang PI, Nalamasu O, Ghoshal R, Schaper CD, Li A, Lu TM |
249 - 254 |
Proximity effects in nanoscale patterning with high resolution electron beam induced deposition Crozier PA |
255 - 259 |
Effect of bis-(3-sodiumsulfopropyl disulfide) byproducts on copper defects after chemical mechanical polishing Hung CC, Lee WH, Hu SY, Chang SC, Chen KW, Wang YL |
260 - 263 |
Hot embossing by Joule heating Lee JC, Leu IC, Lai KL, Hon MH |
267 - 272 |
Junction formation and its device impact through the nodes: From single to coimplants, from beam line to plasma, from single ions to clusters, and from rapid thermal annealing to laser thermal processing Gossmann HJL |
273 - 280 |
Simulation of doping profile formation: Historical evolution, and present strengths and weaknesses Zechner C, Moroz V |
281 - 285 |
Ultrashallow junctions formed by C coimplantation with spike plus submelt laser annealing Felch SB, Collart E, Parihar V, Thirupapuliyur S, Schreutelkamp R, Pawlak BJ, Hoffmann T, Severi S, Eyben P, Vandervorst W, Noda T |
286 - 292 |
Realization of ultrashallow junctions by plasma immersion ion implantation and laser annealing Vervisch V, Etienne H, Torregrosa F, Roux L, Ottaviani L, Pasquinelli M, Sarnet T, Delaporte P |
293 - 297 |
Optimum activation and diffusion with a combination of spike and flash annealing Paul S, Lerch W, Chan J, Mccoy S, Gelpey J, Cristiano F, Severac F, Fazzini PF, Bolze D |
298 - 304 |
Characterization of an ultrashallow junction structure using angle resolved x-ray photoelectron spectroscopy and medium energy ion scattering Saheli G, Conti G, Uritsky Y, Foad MA, Brundle CR, Mack P, Kouzminov D, Werner M, van den Berg JA |
305 - 309 |
Bragg diffraction, synchrotron x-ray reflectance, and x-ray photoelectron spectroscopy studies of low temperature plasma oxidation of native SiO2 on silicon on insulator Bhargava M, Donner W, Srivastava AK, Wolfe JC |
310 - 316 |
Advances in optical carrier profiling through high-frequency modulated optical reflectance Bogdanowicz J, Dortu F, Clarysse T, Vandervorst W, Shaughnessy D, Salnik A, Nicolaides L, Opsal J |
317 - 321 |
Advanced carrier depth profiling on Si and Ge with micro four-point probe Clarysse T, Eyben P, Parmentier B, Van Daele B, Satta A, Vandervorst W, Lin R, Petersen DH, Nielsen PF |
322 - 332 |
Impact of band gap narrowing and surface recombination on photoelectrothermal modulated optical reflectance power curves Dortu F, Bogdanowicz J, Clarysse T, Vandervorst W |
333 - 337 |
Effect of low Ge content on B diffusion in amorphous SiGe alloys Edelman LA, Elliman RG, Rubin L, Washington L, Jones KS |
338 - 341 |
Impact of the environmental conditions on the electrical characteristics of scanning spreading resistance microscopy Eyben P, Mody J, Vemula SC, Vandervorst W |
342 - 346 |
Defect evolution after germanium preamorphization in silicon on insulator structures Fazzinia PF, Cristiano F, Dupre C, Claverie A, Ernst T, Gavelle M |
347 - 350 |
Interaction of the end of range defect band with the upper buried oxide interface for B and BF2 implants in Si and silicon on insulator with and without preamorphizing implant Kah M, Smith AJ, Hamilton JJ, Sharp J, Yeong SH, Colombeau B, Gwilliam R, Webb RP, Kirkby KJ |
351 - 356 |
Toward extending the capabilities of scanning spreading resistance microscopy for fin field-effect-transistor-based structures Mody J, Eyben P, Augendre E, Richard O, Vandervorst W |
357 - 361 |
Level set modeling of the orientation dependence of solid phase epitaxial regrowth Morarka S, Rudawski NG, Law ME |
362 - 367 |
Comparative study of size dependent four-point probe sheet resistance measurement on laser annealed ultra-shallow junctions Petersen DH, Lin R, Hansen TM, Rosseel E, Vandervorst W, Markvardsen C, Kjaer D, Nielsen PF |
368 - 372 |
Boron cathodic arc as an ion source for shallow junction ion implantation of boron Williamsa JM, Klepper CC, Chivers DJ, Hazelton RC, Moschella JJ |
373 - 376 |
Properties of ultralow energy boron implants using octadecaborane Ameen MS, Rubin LM, Harris MA, Huynh C |
377 - 381 |
Evolution of fluorine and boron profiles during annealing in crystalline Si Lopeza P, Pelaz L, Duffy R, Meunier-Beillard P, Roozeboom F, van der Tak K, Breimer P, van Berkum JGM, Verheijen MA, Kaiser M |
382 - 385 |
B clustering in amorphous Si De Salvador D, Bisognin G, Di Marino M, Napolitani E, Carnera A, Mirabella S, Pecora E, Bruno E, Priolo F, Graoui H, Foad MA, Boscherini F |
386 - 390 |
He implantation to control B diffusion in crystalline and preamorphized Si Bruno E, Mirabella S, Priolo F, Kuitunen K, Tuomisto F, Slotte J, Giannazzo F, Bongiorno C, Raineri V, Napolitani E |
391 - 395 |
Antimony for n-type metal oxide semiconductor ultrashallow junctions in strained Si: A superior dopant to arsenic? Bennett NS, Smith AJ, Gwilliam RM, Webb RP, Sealy BJ, Cowern NEB, O'Reilly L, McNally PJ |
396 - 401 |
Probing doping conformality in fin shaped field effect transistor structures using resistors Vandervorst W, Jurczak M, Everaert JL, Pawlak BJ, Duffy R, Del-Agua-Bomiquel JI, Poon T |
402 - 407 |
Doping fin field-effect transistor sidewalls: Impurity dose retention in silicon due to high angle incident ion implants and the impact on device performance Duffy R, Curatola G, Pawlak BJ, Doornbos G, van der Tak K, Breimer P, van Berkum JGM, Roozeboom F |
408 - 414 |
Application of electron holography to analysis of submicron structures Gribelyuk MA, Domenicucci AG, Ronsheim PA, McMurray JS, Gluschenkov O |
415 - 419 |
Carrier concentration profiling on oxidized surfaces of Si device cross sections by resonant electron tunneling scanning probe spectroscopy Bolotov L, Nishizawa M, Kanayama T, Miura Y |
420 - 424 |
Insights in junction photovoltage based sheet resistance measurements for advanced complementary metal-oxide semiconductor Clarysse T, Moussa A, Zangerle T, Schaus F, Vandervorst W, Faifer V, Current M |
425 - 429 |
Defects in Ge and Si caused by 1 MeV Si+ implantation Hickey DP, Bryan ZL, Jones KS, Elliman RG, Haller EE |
430 - 434 |
P implantation into preamorphized germanium and subsequent annealing: Solid phase epitaxial regrowth, P diffusion, and activation Posselt M, Schmidt B, Anwand W, Grotzschel R, Heera V, Mucklich A, Wundisch C, Skorupa W, Hortenbach H, Gennaro S, Bersani M, Giubertoni D, Moller A, Bracht H |
435 - 438 |
Influence of As on the formation of mask-edge defects during stressed solid phase epitaxy in patterned Si wafers Rudawski NG, Jones KS, Elliman RG |
439 - 442 |
Dissolution of extended defects in strained silicon Moroz V, Martin-Bragado I, Felch S, Nouri F, Olsen C, Jones KS |
L10 - L12 |
Fabrication of ideally ordered anodic porous alumina with large area by vacuum deposition of Al onto mold Nishio K, Yanagishita T, Hatakeyama S, Maegawa H, Masuda H |
L13 - L18 |
Flexible polymeric rib waveguide with self-align couplers system Huang CS, Wang WC |
L19 - L22 |
Reducing imaging defects in high-resolution photolithography Wang F, Stanton WA |