D85 - D90 |
Model of multiple metal electrodeposition in porous electrodes Pilone D, Kelsall GH |
D91 - D98 |
Characterization of hybrid poly(acriflavine)/FAD films and their electrocatalytic properties with NAD(+) and NADH Lin KC, Chen SM |
E79 - E84 |
Physical and electrochemical characterizations of PtRu/C catalysts by spray pyrolysis for electrocatalytic oxidation of methanol Xue XZ, Liu CP, Xing W, Lu TH |
E85 - E93 |
Electrochromic devices based on copolymers of 2,5-dimethoxyaniline-diphenylamine Yang CH, Yang TC, Chen CH, Tsai MS |
E94 - E98 |
Evaluation of different voltammetric techniques in the determination of amoxicillin using a carbon paste electrode modified with [N,N'-ethylenebis(salicylideneaminato)] oxovanadium(IV) Bergamini MF, Teixeira MFS, Dockal ER, Bocchi N, Cavalheiro ETG |
F69 - F76 |
Low temperature (< 100 degrees C) deposition of aluminum oxide thin films by ALD with O-3 as oxidant Kim SK, Lee SW, Hwang CS, Min YS, Won JY, Jeong J |
F77 - F80 |
Electrical characteristics of liquid-phase-deposited TiO2 films on GaAs substrate with (NH4)(2)S-x treatment Lee MK, Yen CF, Huang JJ |
F81 - F86 |
Characterization of PbxPty alloy formation on a Pt substrate during liquid-delivery MOCVD of Pb(Zr,Ti)O-3 thin films Zhao JS, Sim JS, Lee HJ, Park DY, Hwang GW, Lee K, Hwang CS |
H89 - H93 |
Batch fabrication and characterization of micro-thin-film thermocouples embedded in metal Datta A, Choi HS, Li XC |
H94 - H104 |
Properties of selective gas-sensitive SnO2/RuO2/Pt composition and detection mechanism Teterycz H, Licznerski BW |
J27 - J31 |
The role of poly(N-vinyl-2-pyrrollidone) in Ag/Pd nanoparticles formation and its application to electroless deposition Yang CC, Wan CC, Wang YY |
J32 - J39 |
Electrochemical quartz crystal microbalance study of copper electrochemical reaction in acid medium containing chlorides Gimenez-Romero D, Gabrielli C, Garcia-Jareno JJ, Perrot H, Vicente F |
A809 - A815 |
Improvements of dispersion homogeneity and cell performance of aqueous-processed LiCoO2 cathodes by using dispersant of PAA-NH4 Li CC, Lee JT, Peng XW |
A816 - A820 |
Polarization behavior of SDC cathode with highly dispersed Ni catalysts for solid oxide electrolysis cells Osada N, Uchida H, Watanabe M |
A821 - A825 |
Charge-transfer reaction at the lithium phosphorus oxynitride glass electrolyte/lithium manganese oxide thin-film interface and its stability on cycling Iriyama Y, Nishimoto K, Yada C, Abe T, Ogumi Z, Kikuchi K |
A826 - A829 |
Dye-sensitized solar cells fabricated by electrospray coating using TiO2 nanocrystal dispersion solution Fujimoto M, Kado T, Takashima W, Kaneto K, Hayase S |
A830 - A834 |
Measurement of LiClO4 diffusion coefficient in propylene carbonate by Moire pattern Nishikawa K, Fukunaka Y, Sakka T, Ogata YH, Selman JR |
A835 - A839 |
Effect of electrode parameters on LiFePO4 cathodes Yu DYW, Donoue K, Inoue T, Fujimoto M, Fujitani S |
A840 - A849 |
Stochastic microstructure reconstruction and direct numerical simulation of the PEFC catalyst layer Mukherjee PP, Wang CY |
A850 - A856 |
GDC-impregnated, (La0.75Sr0.25)(Cr0.5Mn0.5)O-3 anodes for direct utilization of methane in solid oxide fuel cells Jiang SP, Chen XJ, Chan SH, Kwok JT |
A857 - A864 |
Detection of membrane drying, fuel cell flooding, and anode catalyst poisoning on PEMFC stacks by electrochemical impedance spectroscopy Le Canut JM, Abouatallah RM, Harrington DA |
A865 - A868 |
Chemical stability of LiNaSO4 electrolyte during operation in a H-2-O-2 fuel cell Feng Y, Luo JL, Chuang KT |
A869 - A874 |
Oxygen reduction reaction on ruthenium and rhodium nanoparticles modified with selenium and sulfur Cao DX, Wieckowski A, Inukai J, Alonso-Vante N |
A875 - A879 |
Characterization of amorphous LiNiVO4 thin-film anode grown by pulsed laser deposition Tang SB, Xia H, Lai MO, Lu L |
A880 - A886 |
Effects of chrome contamination on the performance of La0.6Sr0.4Co0.2Fe0.8O3 cathode used in solid oxide fuel cells Kim JY, Sprenkle VL, Canfield NL, Meinhardt KD, Chick LA |
A887 - A896 |
Using multi-pseudocriteria and fuzzy outranking relation analysis for material selection of bipolar plates for PEFCs Shanian A, Savadogo O |
A897 - A901 |
Performance of an intermediate-temperature fuel cell using a proton-conducting Sn0.9In0.1P2O7 electrolyte Heo P, Shibata H, Nagao M, Hibino T, Sano M |
A902 - A908 |
Real-time imaging of liquid water in an operating proton exchange membrane fuel cell Hickner MA, Siegel NP, Chen KS, McBrayer DN, Hussey DS, Jacobson DL, Arif M |
A909 - A913 |
In-plane effects in large-scale PEFCs - II. The influence of cooling strategy on cell performance Freunberger SA, Wokaun A, Buchi FN |
A914 - A919 |
Structure characterization and lithiation mechanism of nongraphitized carbon for lithium secondary batteries Nagao M, Pitteloud C, Kamiyama T, Otomo T, Itoh K, Fukunaga T, Tatsumi K, Kanno R |
A920 - A924 |
Anode-shielded, sputter-deposited nanocrystalline Sn thin-film anodes for lithium-ion batteries Chiu KF, Lin HC, Lin KM, Lin TY, Shieh DT |
A925 - A928 |
Improvement of SOFC performance using a microtubular, anode-supported SOFC Suzuki T, Yamaguchi T, Fujishiro Y, Awano M |
A929 - A934 |
Studies on iron (Fe3+/Fe2+)-complex/bromine (Br-2/Br-) redox flow cell in sodium acetate solution Wen YH, Zhang HM, Qian P, Zhou HT, Zhao P, Yi BL, Yang YS |
A935 - A940 |
Water adsorption and storage characteristics of optimized LiCoO2 and LiNi1/3Co1/3Mn1/3O2 composite cathode material for Li-ion cells Mijung N, Lee Y, Cho J |
A941 - A949 |
Carbonaceous materials as proton conductors - I. Fullerenes and polyaromatic hydrocarbons Tasaki K |
B145 - B150 |
Electrochemical behavior of hot-rolled 304 stainless steel during chemical pickling in HCl-based electrolytes Li LF, Daerden M, Caenen P, Celis JP |
B151 - B155 |
Dissolution behavior of Al2CuMg (S phase) in chloride and chromate conversion coating solutions Yoon Y, Buchheit RG |
B156 - B161 |
Inhibiting effects of nitrates on the passive film breakdown of alloy 22 in chloride environments Gray JJ, Hayes JR, Gdowski GE, Orme CA |
B162 - B168 |
A physical model for anticorrosion behavior of duplex coatings Gourbeyre Y, Tribollet B, Dagbert C, Hyspecka L |
B169 - B172 |
Oxidation behavior of tungsten in H2O2- and Fe(NO3)(3)-base aqueous slurries Lim G, Lee JH, Son JW, Lee HW, Kim J |
B173 - B177 |
Suppression of field crystallization of anodic niobia by oxygen Habazaki H, Ogasawara T, Konno H, Shimizu K, Nagata S, Asami K, Takayama K, Skeldon P, Thompson GE |
B178 - B180 |
Tunneling relaxation of photocurrent from passive films on stainless steel Wijesinghe TLSL, Blackwood DJ |
B181 - B186 |
Electrokinetic-current corrosion I. Valves Beck TR |
B187 - B191 |
Electrokinetic-current corrosion II. Lubricated systems Beck TR |
C273 - C276 |
Electrodeposited biaxially textured buffer layer for YBa2Cu3O7-delta (YBCO) superconductor oxide films Bhattacharya R, Phok S, Spagnol P, Chaudhuri T |
C277 - C281 |
Electrochemical synthesis and magnetic properties of CoFe2O4 nanowire arrays Carlier D, Ansermet JP |
C282 - C288 |
Ultraviolet irradiation on hydrogenated amorphous carbon films deposited by atmospheric dielectric barrier discharge Kugimiya T, Kannaka M, Yokomizo M, Nakaue A, Takamatsu H |
C289 - C295 |
Anodic and electroless etching of germanium in alkaline hexacyanoferrate solutions Huygens IM, Cobbaert M, Theuwis A, Strubbe K |
C296 - C300 |
In situ real-time infrared spectroscopy study of formation of porous anodic alumina on Si Kimura Y, Shiraki H, Ishibashi K, Ishii H, Itaya K, Niwano M |
C301 - C304 |
Selective deposition of Cu interconnects by prepatterned Ta film Yang CH, Yang WL, Chang W, Tseng WW |
C305 - C308 |
Effect of current density on microstructure and properties of bulk nanocrystalline Ni-Co alloys prepared by JED Qiao GY, Jing TF, Wang N, Gao YW, Zhao X, Zhou JF, Wang W |
C309 - C317 |
Models for the chemical vapor deposition of tin oxide from monobutyltintrichloride Chae Y, Houf WG, McDaniel AH, Allendorf MD |
C318 - C324 |
Electrodeposition of Ni from low-temperature sulfamate electrolytes I. Electrochemistry and film stress Kelly JJ, Goods SH, Talin AA, Hachman JT |
C325 - C331 |
Electrodeposition of Ni from low-temperature sulfamate electrolytes II. Properties and structure of electrodeposits Goods SH, Kelly JJ, Talin AA, Michael JR, Watson RM |
C332 - C336 |
Electrodeposition of gold on silicon nucleation and growth phenomena Huang Q, Deligianni H, Romankiw LT |
C337 - C343 |
Effects of lead on tin whisker elimination - Efforts toward lead-free and whisker-free electrodeposition of tin Zhang W, Schwager F |
C344 - C348 |
Electrochemical etching using surface-sulfonated electrodes in ultrapure water Ichii Y, Mori Y, Hirose K, Endo K, Yamauchi K, Goto H |
C349 - C356 |
Electrochemical polymerization of pyrrole into nanostructured p-type porous silicon Harraz FA |
C357 - C364 |
Effects of deposition conditions on the morphology of zinc deposits from alkaline zincate solutions Wang RY, Kirk DW, Zhang GX |
C365 - C376 |
Electrochromic nanostructured tungsten oxide films by sol-gel: Structure and intercalation properties Deepa M, Joshi AG, Srivastava AK, Shivaprasad SM, Agnihotry SA |
G363 - G371 |
Low-temperature LPCVD of polycrystalline GexSi1-x films with high germanium content Kovalgin A, Holleman J |
G372 - G378 |
Effects of slurry flow rate and pad conditioning temperature on dishing, erosion, and metal loss during copper CMP Mudhivarthi S, Gitis N, Kuiry S, Vinogradov M, Kumar A |
G379 - G384 |
Analysis of the leakage current origin in thin strain relaxed buffer substrates Eneman G, Simoen E, Delhougne R, Verheyen P, Simons V, Loo R, Caymax M, Claeys C, Vandervorst W, De Meyer K |
G385 - G388 |
Effects of electrical bias stress on the performance of ZnO-based TFTs fabricated by RF magnetron sputtering Navamathavan R, Yang EJ, Lim JH, Hwang DK, Oh JY, Yang JH, Jang JH, Park SJ |
G389 - G393 |
Metal wet etch issues and effects in dual metal gate stack integration Hussain MM, Moumen N, Zhang ZB, Womack BF |
G394 - G398 |
Mechanism of copper removal from SiO2 surfaces by hydrogen cyanide aqueous solutions Fujiwara N, Liu YL, Takahashi M, Kobayashi H |
G399 - G404 |
Effects of disk design and kinematics of conditioners on process hydrodynamics during copper CMP Li ZL, Lee H, Borucki L, Rogers C, Kikuma R, Rikita N, Nagasawa K, Philipossian A |
G405 - G409 |
Isolated carbon confinement methodology for ultrathin boron profiles in strained layers of silicon germanium Enicks D, Oleszek G |
G410 - G416 |
Hafnium-doped tantalum oxide high-k gate dielectrics Lu J, Kuo Y, Tewg JY |
G417 - G419 |
Electrical and physical analysis of MoTa alloy for gate electrode applications Chen B, Biswas N, Misra V |
G420 - G427 |
Effects of plasma treatments on ultralow-k dielectric film and Ta barrier properties in Cu damascene processing Kumar R, Wong TKS, Murthy BR, Wang YH, Balasubramanian N |
G428 - G436 |
Modeling copper CMP removal rate dependency on wafer pressure, velocity, and dissolved oxygen concentration DeNardis D, Doi T, Hiskey B, Ichikawa K, Ichikawa D, Philipossian A |
G437 - G442 |
Evaluation of atomic layer deposited NbN and NbSiN as metal gate materials Van Hoornick N, De Witte H, Witters T, Zhao C, Conard T, Huotari H, Swerts J, Schram T, Maes JW, De Gendt S, Heyns M |
G443 - G452 |
Study of the carry-over layer and its importance for wet processing of semiconductor substrates Fyen W, Mertens PW |
G453 - G461 |
Analysis of large particle count in fumed silica slurries and its correlation with scratch defects generated by CMP Remsen EE, Anjur S, Boldridge D, Kamiti M, Li ST, Johns T, Dowell C, Kasthurirangan J, Feeney P |
G462 - G464 |
Ti/Au ohmic contacts to Al-doped n-ZnO grown by pulsed laser deposition Chen JJ, Anderson TJ, Jang S, Ren F, Li YJ, Kim HS, Gila BP, Norton DP, Pearton SJ |
G465 - G469 |
Area-selective ALD of titanium dioxide using lithographically defined poly (methyl methacrylate) films Sinha A, Hess DW, Henderson CL |
G470 - G474 |
Bias-temperature stability of Ti-Si-N-O films Ee YC, Juneja JS, Wang PI, Lu TM, Bakhru H, Chan L, Law SB, Yong C, Chen Z, Xu S |
G475 - G478 |
The influences of contact interfaces between the indium tin oxide-based contact layer and GaN-based LEDs Hsu CY, Lan WH, Wu YCS |
G479 - G482 |
Shallow and thermally stable ohmic contacts to p-InAsP Wang SH, Lysczek EM, Liu BZ, Robinson JA, Mohney SE |
G483 - G491 |
Investigation of wet etching properties and annealing effects of Hf-based high-k materials Chen JH, Yoo WJ, Chan DSH |
G492 - G497 |
High-reliability Ta2O5 metal-insulator-metal capacitors with Cu-based electrodes Tsai KC, Wu WF, Chao CG, Kuan CP |
G498 - G501 |
Effect of temperature on novel InAIGaP/GaAs/InGaAs camel-gate pseudomorphic high-electron-mobility transistors Lin YS, Hsieh YL |
G502 - G505 |
Estimating temperature dependence of generation lifetime extracted from drain current transients - Model Martino JA, Galeti M, Rafi JM, Mercha A, Simoen E, Claeys C |
G506 - G510 |
Epitaxial growth of CoSi2 layer on a Si(100) substrate using a CoNx interlayer deposited by reactive sputtering Kim SI, Lee SR, Park JH, Ahn BT |
G511 - G514 |
Interface properties of room-temperature-grown oxides on Si0.15Ge0.85 layers Das R, Bera MK, Chakraborty S, Saha AR, Maiti CK |
H105 - H109 |
Effect of pH and lattice distortion on the luminescence of (Y, Gd) BO3 : Eu3+ phosphor prepared by the coprecipitation method Lee GH, Kang SH |