| 3575 - 3578 |
A vanadium-based cathode for lithium-ion batteries
Chaloner-Gill B, Shackle DR, Andersen TN |
| 3579 - 3583 |
Evaluation of graphite materials as anodes for lithium-ion batteries
Cao F, Barsukov IV, Bang HJ, Zaleski P, Prakash J |
| 3584 - 3591 |
AC impedance analysis of bifunctional air electrodes for metal-air batteries
Arai H, Muller S, Haas O |
| 3592 - 3597 |
Electrochemistry and structural chemistry of Li[CrTi]O-4 (Fd(3)over-barm) in nonaqueous lithium cells
Ohzuku T, Tatsumi K, Matoba N, Sawai K |
| 3598 - 3605 |
Understanding irreversible capacity in LixNi1-yFeyO2 cathode materials
Mueller-Neuhaus JR, Dunlap RA, Dahn JR |
| 3606 - 3609 |
Electrical and ionic conductivity of Gd-doped ceria
Wang SR, Kobayashi T, Dokiya M, Hashimoto T |
| 3610 - 3613 |
Polymer solid acid composite membranes for fuel-cell applications
Boysen DA, Chisholm CRI, Haile SM, Narayanan SR |
| 3614 - 3620 |
Optimization of the preparation conditions of sol-gel derived Ni-Co oxide films
Serebrennikova I, Birss VI |
| 3621 - 3627 |
Li[Mn-2]O-4 spinel cathode material showing no capacity fading in the 3 V range
Kang SH, Goodenough JB |
| 3628 - 3632 |
Thermal stability of the HOPG/liquid electrolyte interphase studied by in situ electrochemical atomic force microscopy
Edstrom K, Herranen M |
| 3633 - 3636 |
New fluoride cathodes for rechargeable lithium batteries
Koyama Y, Tanaka I, Adachi H |
| 3637 - 3646 |
Corrosion mechanism of nickel in hot, concentrated H2SO4
Kish JR, Ives MB, Rodda JR |
| 3647 - 3653 |
Pit growth of AA 1050 aluminum plates electrograined in nitric acid
Lin CS, Chang CC, Hsieh SH |
| 3654 - 3660 |
Localized electrochemical methods applied to cut edge corrosion
Ogle K, Baudu V, Garrigues L, Philippe X |
| 3661 - 3666 |
A scanning vibrating electrode study of chromated-epoxy primer on steel and aluminum
He J, Gelling VJ, Tallman DE, Bierwagen GP |
| 3667 - 3672 |
Conducting polymers and corrosion III. A scanning vibrating electrode study of poly(3-octyl pyrrole) on steel and aluminum
He J, Gelling VJ, Tallman DE, Bierwagen GP, Wallace GG |
| 3673 - 3679 |
Electrochemistry and corrosion of beryllium in buffered and unbuffered chloride solutions
Venugopal A, Macdonald DD, Varma R |
| 3680 - 3686 |
Carbon-induced corrosion of nickel anode
Chun CM, Mumford JD, Ramanarayanan TA |
| 3687 - 3690 |
Numerical solution of cathodic protection systems with nonlinear polarization curves
Sun W, Liu KM |
| 3691 - 3699 |
Fluorescence and near-field scanning optical microscopy for investigating initiation of localized corrosion of Al 2024
Buchler M, Kerimo J, Guillaume F, Smyrl WH |
| 3700 - 3707 |
Initiation process of film formation for cationic electropaint system
Suzuki Y, Fukui H, Tsuchiya K, Ogata YH |
| 3708 - 3717 |
Structural properties of SnxSy thin films prepared by plasma-enhanced chemical vapor deposition
Sanchez-Juarez A, Ortiz A |
| 3718 - 3724 |
The role of metal hydroxides in NiFe deposition
Vaes J, Fransaer J, Celis JP |
| 3725 - 3729 |
Electrochemical quartz crystal microbalance study of additive effects in pulsed deposition of Cu-Co alloys
Kelly JJ, Kern P, Landolt D |
| 3730 - 3733 |
Energetics of copper deposition based on Cu(I) precursors
Choi ES, Lee HH |
| 3734 - 3738 |
Electrodehalogenation of trichlorofluoromethane on lead cathodes using hydrogen diffusion anodes
Cabot PL, Centelles M, Segarra L, Casado J |
| 3739 - 3744 |
Impedance analysis of gas-diffusion electrode coated with a thin layer of fluoro ionomer to enhance its stability in oxygen reduction
Sudoh M, Kondoh T, Kamiya N, Ueda T, Okajima K |
| 3745 - 3750 |
Selective catalytic reduction of nitric oxide by ethane using solid oxide membranes
Hibino T, Inoue T, Sano M |
| 3751 - 3758 |
A microelectrode study of competing electrode reactions in the commercial process for the hydrodimerization of acrylonitrile to adiponitrile
Watson M, Pletcher D, Sopher DW |
| 3759 - 3767 |
Porous anodic etching of p-Cd1-xZnxTe studied by photocurrent spectroscopy
Erne BH, Mathieu C, Vigneron J, Million A, Etcheberry A |
| 3768 - 3770 |
Electrically heated cylindrical microelectrodes - Comparison of temperature profiles obtained by IR photography and digital simulation
Schneider A, Flechsig GU, Grundler P |
| 3771 - 3774 |
N-vinylcarbazole-acrylamide copolymer electrodes -Electrochemical response to dopamine
Sezer E, Yavuz O, Sarac AS |
| 3775 - 3784 |
Effect of substrate on polyaniline film properties - A cyclic voltammetry and impedance study
Dinh HN, Birss VI |
| 3785 - 3789 |
Patterned metallization of porous silicon from electroless solution for direct electrical contact
Gole JL, Seals LT, Lillehei PT |
| 3790 - 3800 |
Electrochemical studies of the molten system K2NbF7-Na2O-Nb-(LiF-NaF-KF)(eut) at 700 degrees C
Rosenkilde C, Vik A, Ostvold T, Christensen E, Bjerrum NJ |
| 3801 - 3807 |
Anion transport in Prussian blue films in acetonitrile and propylene carbonate solutions
Lee H, Yang H, Kim YT, Kwak J |
| 3808 - 3815 |
Thermoelectrochemical transfer function under thermal laminar free convection at a vertical electrode
Aaboubi O, Citti I, Chopart JP, Gabrielli C, Olivier A, Tribollet B |
| 3816 - 3819 |
Chemical mechanical polishing of low dielectric constant oxide films deposited using flowfill chemical vapor deposition technology
Cui H, Bhat IB, Murarka SP, Lu HQ, Li WD, Hsia WJ, Catabay W |
| 3820 - 3826 |
Hydroxyl radical formation in H2O2-amino acid mixtures and chemical mechanical polishing of copper
Hariharaputhiran M, Zhang J, Ramarajan S, Keleher JJ, Li YZ, Babu SV |
| 3827 - 3832 |
A new dummy-free shallow trench isolation concept for mixed-signal applications
Badenes G, Rooyackers R, Augendre E, Vandamme E, Perello C, Heylen N, Grillaert J, Deferm L |
| 3833 - 3839 |
Postexposure delay effect on linewidth variation in base added chemically amplified resist
Ku CY, Shieh JM, Chiou TB, Lin HK, Lei TF |
| 3840 - 3844 |
Asymmetrical critical current density and its influence on electromigration of two-level W-plug interconnection
Huang JS, Oates AS, Obeng YS, Brown WL |
| 3845 - 3849 |
Formation of SiCSOI structures by direct growth on insulating layers
Chen J, Scofield J, Steckl AJ |
| 3850 - 3852 |
GaAs etch rate enhancement with SF6 addition to BCl3 plasmas
Nordheden KJ, Upadhyaya K, Lee YS, Gogineni SP, Kao MY |
| 3853 - 3858 |
Migration-adsorption mechanism of metallic impurities out of chemically amplified photoresist onto silicon-based substrates
Yang CC, Ko FH, Wang MY, Wang TK, Wu SC |
| 3859 - 3863 |
Analysis of epitaxy of polysilicon films on silicon (100) wafers deposited with enlarged microwave plasma
Ryoo K, Shindo W, Hirayama M, Ohmi T |
| 3864 - 3867 |
Amorphous CNx layers from neon electron cyclotron resonance plasmas with N-2 and CH4 as precursors
Barbadillo L, Hernandez MJ, Cervera M, Piqueras J |
| 3868 - 3872 |
The mechanism of Si incorporation and the digital control of Si content during the metallorganic atomic layer deposition of Ti-Si-N thin films
Min JS, Park JS, Park HS, Kang SW |
| 3873 - 3878 |
A general optimization for slurry injection during chemical mechanical polishing
Chou FC, Fu MN, Wang MW |
| 3879 - 3888 |
Analytical tools for the characterization of power devices
Schulze HJ, Frohnmeyer A, Niedernostheide FJ, Simmnacher B, Kolbesen BO, Tutto P, Pavelka T, Wachutka G |
| 3889 - 3891 |
Increased copper outplating from dilute HF solutions on microstructurally modified silicon surfaces
Chen Z, Lee SM, Singh RK |
| 3892 - 3898 |
Protection of silicon wafers from alkali contamination during high-temperature processing using electric field
Beregovsky M, Klyuch A, Raskin Y, Zinman Y, Shacham-Diamand Y, Deal BE |
| 3899 - 3906 |
The sensitivity of thermal donor generation in silicon to self-interstitial sinks
Voronkov VV, Voronkova GI, Batunina AV, Falster R, Golovina VN, Guliaeva AS, Tiurina NB, Milvidski MG |
| 3907 - 3913 |
Abrasive-free polishing for copper damascene interconnection
Kondo S, Sakuma N, Homma Y, Goto Y, Ohashi N, Yamaguchi H, Owada N |
| 3914 - 3916 |
Inductively coupled plasma etching of doped GaN films with Cl-2/Ar discharges
Cho BC, Im YH, Hahn YB, Nahm KS, Lee YS, Pearton SJ |
| 3917 - 3921 |
Quenching of porous silicon photoluminescence by ammonia hydrogen peroxide mixture
Fukuda Y, Yu YD, Zhou W, Furuya K, Suzuki H |
| 3922 - 3930 |
Operational aspects of chemical mechanical polishing - Polish pad profile optimization
Chen CY, Yu CC, Shen SH, Ho M |
| 3931 - 3934 |
Perovskite-type oxide-based electrode: A new sensor for hydrogen-phosphate ion
Shimizu Y, Ishikawa A, Iseki K, Takase S |
| 3935 - 3939 |
Effects of H-2 and/or O-2 plasma treatments on photoconductivity of freestanding polycrystalline diamond films
Kim SH, Han IT, Kim YH, Kim TG, Kang SG, Lee SH, Moon SB, Kim DG |
| 3940 - 3943 |
Fabrication and application of a composite optical waveguide using peroxopolytungstic acid films
Qi ZM, Itoh K, Murabayashi M, Yimit A, Yanagi H |
| 3944 - 3947 |
The synthesis of fine particle yttrium vanadate phosphors from spherical powder precursors using urea precipitation
Newport A, Silver J, Vecht A |
| 3948 - 3952 |
Influence of co-doping with Cl- on the luminescence of CaS : Eu2+
Jia DD, Zhu J, Wu BQ |
| 3953 - 3974 |
Report on the Electrolytic Industries for the year 1999
Weidner JW, Doyle M |
| 3977 - 3977 |
Acid-based etching of silicon wafers: Mass-transfer and kinetic effects (vol 147, pg 176, 2000)
Kulkarni MS, Erk HF |
