검색결과 : 3건
| No. | Article |
|---|---|
| 1 |
Orientation and microstructure dependence of electromigration damage in damascene Cu interconnect lines Mirpuri KK, Szpunar J Materials Science Forum, 495-497, 1443, 2005 |
| 2 |
New interpretation of the influence of various parameters on texture evolution in damascene Cu interconnect lines Mirpuri KK, Szpunar J Materials Science Forum, 495-497, 1449, 2005 |
| 3 |
Active microelectronic chip devices which utilize controlled electrophoretic fields for multiplex DNA hybridization and other genomic applications Heller MJ, Forster AH, Tu E Electrophoresis, 21(1), 157, 2000 |