화학공학소재연구정보센터
Materials Science Forum, Vol.495-497, 1449-1454, 2005
New interpretation of the influence of various parameters on texture evolution in damascene Cu interconnect lines
The article takes into account various factors which effect the texture evolution in the Cu lines. We propose here an explanation for the formation of {111}< 110 > and {111}< 112 > texture in the Cu lines. The explicit role of principal stresses, shear stresses and dislocations is discussed. The influence of line spacing on strength of the {111}< 110 > and {111}< 112 > texture components is also demonstrated in relation to the dislocation density.