| 1 |
The research on preparation of superhydrophobic surfaces of pure copper by hydrothermal method and its corrosion resistance
Wan YX, Chen MJ, Liu W, Shen XX, Min YL, Xu QJ
Electrochimica Acta, 270, 310, 2018 |
| 2 |
Thin-film UV.vis spectroscopy as a chemically-sensitive monitoring tool for copper etching bath
Lambert A, Asokan M, Issac G, Love C, Chyan O
Journal of Industrial and Engineering Chemistry, 51, 44, 2017 |
| 3 |
Local etching of copper films by the Scanning Electrochemical Microscope in the feedback mode: A theoretical and experimental investigation
Cornut R, Nunige S, Lefrou C, Kanoufi F
Electrochimica Acta, 56(28), 10701, 2011 |
| 4 |
Si cleaning method without surface morphology change by cyanide solutions
Takahashi M, Liu YL, Narita H, Kobayashi H
Applied Surface Science, 254(12), 3715, 2008 |
| 5 |
Damage mechanism in low-dielectric (low-k) films during plasma processes
Jinnai B, Nozawa T, Samukawa S
Journal of Vacuum Science & Technology B, 26(6), 1926, 2008 |
| 6 |
Hydrogen bromide plasma-copper reaction in a new copper etching process
Lee S, Kuo Y
Thin Solid Films, 457(2), 326, 2004 |
| 7 |
Electrochemical investigations of copper behaviour in different cupric complex solutions: Voltammetric study
Drissi-Daoudi R, Irhzo A, Darchen A
Journal of Applied Electrochemistry, 33(3-4), 339, 2003 |
