검색결과 : 3건
| No. | Article |
|---|---|
| 1 |
Mechanism of Cobalt Bottom-Up Filling for Advanced Node Interconnect Metallization Wu J, Wafula F, Branagan S, Suzuki H, van Eisden J Journal of the Electrochemical Society, 166(1), D3136, 2018 |
| 2 |
Effect of the deposition parameters on the voiding propensity of solder joints with Cu electroplated in a Hull cell Wafula F, Liu Y, Yin L, Borgesen P, Cotts EJ, Dimitrov N Journal of Applied Electrochemistry, 41(4), 469, 2011 |
| 3 |
Impact of Key Deposition Parameters on the Voiding Sporadically Occurring in Solder Joints with Electroplated Copper Wafula F, Liu Y, Yin L, Bliznakov S, Borgesen P, Cotts EJ, Dimitrov N Journal of the Electrochemical Society, 157(2), D111, 2010 |