A quantitative study of the impact of key Cu plating parameters on the voiding propensity of solder joints with Cu electroplated in a commercially available plating solution (CAPS) is performed first on 0.3 cm(2) Cu rotating disk electrode. It is shown that similar to samples plated in a generic plating solution (GPS) containing bis(3-sulfopropyl) disulfide, polyethylene glycol, and Cl(-) ions, void-prone samples are deposited predominantly at higher overpotentials, in the range from positive to -0.20 V. In the second part, a Hull cell with 46 cm(2) cathode is used to scale up the voiding study in both, GPS and CAPS. It is demonstrated that plating conditions could be chosen in a way to generate both, void-prone and void-proof Cu on the same cathode panel. Thus, the controlled voiding propensity illustrated for the first time in a prototype of industrial Cu plating helps in realizing the sporadic nature of the voiding phenomenon.