검색결과 : 12건
| No. | Article |
|---|---|
| 1 |
Effects of failure location and pressure on the core voiding under SGTR accident in a LBE-cooled fast reactor Zhang CD, Sa RY, Zhou DN, Zhang GY, Wang L International Journal of Heat and Mass Transfer, 141, 940, 2019 |
| 2 |
Tensile secondary creep rate analysis of a dental veneering porcelain Lunt AJG, Kabra S, Kelleher J, Zhang SY, Neo TK, Korsunsky AM Thin Solid Films, 596, 269, 2015 |
| 3 |
Effect of the deposition parameters on the voiding propensity of solder joints with Cu electroplated in a Hull cell Wafula F, Liu Y, Yin L, Borgesen P, Cotts EJ, Dimitrov N Journal of Applied Electrochemistry, 41(4), 469, 2011 |
| 4 |
Structure-dependent behavior of stress-induced voiding in Cu interconnects Wu ZY, Yang YT, Chai CC, Li YJ, Wang JY, Li B, Liu J Thin Solid Films, 518(14), 3778, 2010 |
| 5 |
Influence of plating parameters and solution chemistry on the voiding propensity at electroplated copper-solder interface Liu Y, Wang J, Yin L, Kondos P, Parks C, Borgesen P, Henderson DW, Cotts EJ, Dimitrov N Journal of Applied Electrochemistry, 38(12), 1695, 2008 |
| 6 |
The microstructure of a polyethylene terephthalate matrix near to a void under uniaxial draw Nevalainen K, MacKerron DH, Everall NJ, Kuusipalo J Materials Chemistry and Physics, 101(1), 103, 2007 |
| 7 |
The effect of aspect ratio scaling on hydrostatic stress in passivated interconnects Ang D, Wong CC, Ramanujan RV Thin Solid Films, 515(6), 3246, 2007 |
| 8 |
The influence of temperature and dielectric materials on stress induced voiding in Cu dual damascene interconnects Gan ZG, Shao W, Mhaisalkar SG, Chen Z, Li HY Thin Solid Films, 504(1-2), 161, 2006 |
| 9 |
The effect of line width on stress-induced voiding in Cu dual damascene interconnects Shao W, Gan ZH, Mhaisalkar SG, Chen Z, Li HY Thin Solid Films, 504(1-2), 298, 2006 |
| 10 |
Voiding behaviour and microstructure of a filled polyester film Nevalainen K, MacKerron DH, Kuusipalo J Materials Chemistry and Physics, 92(2-3), 540, 2005 |