검색결과 : 4건
| No. | Article |
|---|---|
| 1 |
Online implementation of SVM based fault diagnosis strategy for PEMFC systems Li ZL, Outbib R, Giurgea S, Hissel D, Jemei S, Giraud A, Rosini S Applied Energy, 164, 284, 2016 |
| 2 |
Temperature prediction for system in package assembly during the reflow soldering process Deng SS, Hwang SJ, Lee HH International Journal of Heat and Mass Transfer, 98, 1, 2016 |
| 3 |
Reliability prediction for 95.5Sn3.9Ag0.6Cu solder bump and thermal design for lead free system in package with polymer-based material Hsu HC, Hung WM Materials Science Forum, 505-507, 289, 2006 |
| 4 |
Passive and heterogeneous integration towards a Si-based System-in-Package concept Roozeboom F, Kemmeren ALAM, Verhoeven JFC, van den Heuvel FC, Klootwijk J, Kretschman H, Fric T, van Grunsven ECE, Bardy S, Bunel C, Chevrie D, LeCornec F, Ledain S, Murray F, Philippe P Thin Solid Films, 504(1-2), 391, 2006 |