검색결과 : 5건
| No. | Article |
|---|---|
| 1 |
Use of lateral film structure for ultrathin diffusion barrier thermal stability study Lim BK, Park HS, Tan V, See AKH, Seet CS, Lee TJ, Yakovlev NL Journal of Vacuum Science & Technology B, 23(1), 119, 2005 |
| 2 |
Bias-temperature stressing analysis on the stability of an ultrathin Ta diffusion barrier Lim BK, Park HS, Chin LK, Woo SW, See AKH, Seet CS, Lee TJ, Yakovlev NL Journal of Vacuum Science & Technology B, 22(4), 1844, 2004 |
| 3 |
Bias-temperature stress analysis of Cu/ultrathin Ta/SiO2/Si interconnect structure Lim BK, Park HS, Chin LK, Woo SW, See AKH, Seet CS, Lee TJ, Yakovlev NL Journal of Vacuum Science & Technology B, 22(5), 2286, 2004 |
| 4 |
Effect of processing parameters on electroless Cu seed layer properties Ee YC, Chen Z, Chan L, See AKH, Law SB, Tee KC, Zeng KY, Shen L Thin Solid Films, 462-63, 197, 2004 |
| 5 |
Comparison of in situ and ex situ plasma-treated metalorganic chemical vapor deposition titanium nitride thin films Lim BK, Park HS, See AKH, Liu EZ, Wu SH Journal of Vacuum Science & Technology B, 20(6), 2219, 2002 |