검색결과 : 3건
| No. | Article |
|---|---|
| 1 |
Characterization of electroplated copper films for three-dimensional advanced packaging Seah CH, You GZ, Li CY, Kumar R Journal of Vacuum Science & Technology B, 22(3), 1106, 2004 |
| 2 |
Enhancement of adhesion strength of Cu seed Bayer with different thickness in Cu/low-k multilevel interconnects Wang G, Jong YW, Balakumar S, Seah CH, Hara T Journal of Vacuum Science & Technology B, 22(5), 2384, 2004 |
| 3 |
Annealing of copper electrodeposits Seah CH, Mridha S, Chan LH Journal of Vacuum Science & Technology A, 17(4), 1963, 1999 |