검색결과 : 3건
| No. | Article |
|---|---|
| 1 |
The Crack Opening Method in Silicon-Wafer Bonding - How Useful Is It Martini T, Steinkirchner J, Gosele U Journal of the Electrochemical Society, 144(1), 354, 1997 |
| 2 |
SILICON-WAFER BONDING VIA DESIGNED MONOLAYERS STEINKIRCHNER J, MARTINI T, REICHE M, KASTNER G, GOSELE U Advanced Materials, 7(7), 662, 1995 |
| 3 |
A Simple Chemical Treatment for Preventing Thermal Bubbles in Silicon-Wafer Bonding Tong QY, Kaido G, Tong L, Reiche M, Shi F, Steinkirchner J, Tan TY, Gosele U Journal of the Electrochemical Society, 142(10), L201, 1995 |