Communication: Silicon wafer bonding is a technology which allows two silicon wafers to stick together without any glue (e.g, see Fig.). The technique is used in the areas of microelectronics, micromechanics, and power electronics. Hydrolyzed tetramethoxysilane is used in the new bonding process presented here, providing a low-temperature method of wafer bonding compatible with the presence of microelectronics aluminum metallization.