| 1 |
직접 주형법을 이용한 메조다공성 나노막대형 탄소 재료의 합성과 고성능 전기이중층 캐패시터 전극으로의 적용
강현철, 황기범, 신은선, 김재광, 표성규, 윤성훈
Polymer(Korea), 45(3), 450, 2021 |
| 2 |
Effect of chemical mechanical treatment on the optoelectronic properties in CMOS image sensor
Choi E, Kim A, Kwon SH, Cui Y, Lee SJ, Lee U, Choi HS, Hahn SJ, Yoon SP, Son HB, Pyo SG
Korean Journal of Chemical Engineering, 32(2), 199, 2015 |
| 3 |
Fabrication and evaluation of nickel cobalt alloy electrocatalysts for alkaline water splitting
Hong SH, Ahn SH, Choi I, Pyo SG, Kim HJ, Jang JH, Kim SK
Applied Surface Science, 307, 146, 2014 |
| 4 |
Characterization and Selective Properties of Electroless Deposited All Wet Contact Electrode
Kim A, Lee SJ, Choi E, Pyo SG
Journal of the Electrochemical Society, 161(3), D118, 2014 |
| 5 |
Enhanced charge storage by optimization of pore structure in nanocomposite between ordered mesoporous carbon and nanosized WO3-x
Zhou Y, Ko S, Lee CW, Pyo SG, Kim SK, Yoon S
Journal of Power Sources, 244, 777, 2013 |
| 6 |
Effect of Palladium Ion on Facilitated Olefin Transport through Silver-Polymer Complex Membranes
Park HH, Won J, Pyo SG, Park H
Macromolecular Research, 19(10), 1077, 2011 |
| 7 |
Effects of metal stacks and patterned metal profiles on the electromigration characteristics in super-thin AlCu interconnects for sub-0.13 mu m technology
Lee MH, Kwon YM, Pyo SG, Lee HC, Han JW, Paik KW
Thin Solid Films, 519(11), 3906, 2011 |
| 8 |
Accelerated Superfilling Behavior and Suppressed Agglomeration of CEMOCVD Cu Film Using In Situ Plasma Treatment
Pyo SG, Kim S
Electrochemical and Solid State Letters, 12(1), H14, 2009 |
| 9 |
Investigating the Planarization Behavior of High Selective Slurry with Initial Step Height and Pattern Density
Pyo SG, Kim M, Kim H, Kim S
Electrochemical and Solid State Letters, 12(7), H241, 2009 |
| 10 |
3D Interconnect Process Integration and Characterization of Back Side Illuminated CMOS Image Sensor with 1.75 mu m Pixels
Pyo SG, Park SH, Kim S
Journal of the Electrochemical Society, 156(6), J143, 2009 |
