| 1 |
In situ measurement of plasma charging on SiO2 hole bottoms and reduction by negative charge injection during etching
Ohmori T, Makabe T
Applied Surface Science, 254(12), 3696, 2008 |
| 2 |
Increased O(D-1) metastable flux with Ar and Kr diluted oxygen plasmas and improved film properties of grown SiO2 film
Kitajimaa T, Nakano T, Makabe T
Journal of Vacuum Science & Technology A, 26(5), 1308, 2008 |
| 3 |
Special Issue on the 4th International Workshop on Basic Aspects of Nonequilibrium Plasmas Interacting with Surfaces - Preface
Makabe T, Samukawa S
Applied Surface Science, 253(16), 6617, 2007 |
| 4 |
Data and modeling of negative ion transport in gases of interest for production of integrated circuits and nanotechnologies
Petrovic ZL, Raspopovic ZM, Stojanovic VD, Jovanovic JV, Malovic G, Makabe T, de Urquijo J
Applied Surface Science, 253(16), 6619, 2007 |
| 5 |
Optical emission diagnostics of etching of low-k dielectrics in a two frequency inductively coupled plasma
Miyauchi M, Miyoshi Y, Petrovic ZL, Makabe T
Solid-State Electronics, 51(10), 1418, 2007 |
| 6 |
Modeling of dc magnetron plasma for sputtering: Transport of sputtered copper atoms
Yagisawa T, Makabe T
Journal of Vacuum Science & Technology A, 24(4), 908, 2006 |
| 7 |
Optical diagnostics for plasma-surface interaction in CF4/Ar radio-frequency inductively coupled plasma during Si and SiO2 etching
Miyoshi Y, Miyauchi M, Oguni A, Makabe T
Journal of Vacuum Science & Technology A, 24(5), 1718, 2006 |
| 8 |
Oxygen atom density in rare gas diluted O-2 radio frequency plasma
Kitajima T, Nakashima J, Nakano T, Makabe T
Thin Solid Films, 506, 489, 2006 |
| 9 |
Modeling of radial uniformity at a wafer interface in a 2f-CCP for SiO2 etching
Yagisawa T, Shimada T, Makabe T
Journal of Vacuum Science & Technology B, 23(5), 2212, 2005 |
| 10 |
Modeling of the influence of dielectric target on interface sheath characteristics in a radio-frequency magnetron sputtering
Kuroiwa S, Mine T, Yagisawa T, Makabe T
Journal of Vacuum Science & Technology B, 23(5), 2218, 2005 |
