검색결과 : 1건
| No. | Article |
|---|---|
| 1 |
Reliability prediction for 95.5Sn3.9Ag0.6Cu solder bump and thermal design for lead free system in package with polymer-based material Hsu HC, Hung WM Materials Science Forum, 505-507, 289, 2006 |
| No. | Article |
|---|---|
| 1 |
Reliability prediction for 95.5Sn3.9Ag0.6Cu solder bump and thermal design for lead free system in package with polymer-based material Hsu HC, Hung WM Materials Science Forum, 505-507, 289, 2006 |