검색결과 : 3건
| No. | Article |
|---|---|
| 1 |
The effect of tricyclazole as a novel leveler for filling electroplated copper microvias Liao CH, Zhang ST, Chen SJ, Qiang YJ, Liu G, Tang MX, Tan BC, Fu DL, Xu Y Journal of Electroanalytical Chemistry, 827, 151, 2018 |
| 2 |
2-Mercaptopyridine as a new leveler for bottom-up filling of micro-vias in copper electroplating Chang C, Lu XB, Lei ZW, Wang ZL, Zhao C Electrochimica Acta, 208, 33, 2016 |
| 3 |
A study of bottom-up electroplated copper filling by the potential difference between two rotating speeds of a working electrode Lu XB, Yao LJ, Ren SJ, Wang ZL Journal of Electroanalytical Chemistry, 712, 25, 2014 |