In order to achieve a bottom-up plated copper filling with a minimal surface thickness, an additive system containing a pluronic triblock copolymers, ethylene oxide terminal blocks termed EPE as a suppressor, bis(3-sulfopropyl) disulfide (SPS) as accelerator, Janus Green B (JGB) as leveler, and Cl- was used to investigated bottom-up filling by galvanostatic measurements method and cross-sectional OM observation. The EPE-8000 not only was a stronger inhibition for electrodeposition copper reaction, but also had a stronger forced convection with JGB and Cl- in copper electroplating solution than PEG-8000 for copper deposition. The potential difference obtained from two different rotating speeds of a copper working electrode by galvanostatic measurements reached positive 20 mV with an addition of the EPE-8000 and was much higher than that with an addition of PEG-8000 (about 12 mV), which led to a high filling performance with a minimal surface copper thickness. The effects of additives SPS, JGB, and Cl- on the potential difference and bottom-up filling behavior were investigated in detail. With an addition of EPE-8000, the filling performance of the plating copper solution was enhanced, the surface thickness of deposited copper film was reduced, but also the operation windows of four additives were widened extensively. (C) 2013 Elsevier B.V. All rights reserved.