화학공학소재연구정보센터
검색결과 : 4건
No. Article
1 Influence of Copper Ion Concentration on the Kinetics of Formation of a Protective Layer on Copper in an Acidic CMP Solution Containing BTA and Glycine
Choi S, Dornfeld DA, Doyle FM
Journal of the Electrochemical Society, 160(10), H653, 2013
2 Copper CMP Modeling: Millisecond Scale Adsorption Kinetics of BTA in Glycine-Containing Solutions at pH 4
Choi S, Tripathi S, Dornfeld DA, Doyle FM
Journal of the Electrochemical Society, 157(12), II1153, 2010
3 Self-conditioning fixed abrasive pad in CMP
Kim H, Park B, Lee S, Jeong H, Dornfeld DA
Journal of the Electrochemical Society, 151(12), G858, 2004
4 Optimization of CMP from the viewpoint of consumable effects
Luo JF, Dornfeld DA
Journal of the Electrochemical Society, 150(12), G807, 2003