검색결과 : 10건
| No. | Article |
|---|---|
| 1 |
실리콘 태양전지 투명전극용 스크린 프린팅을 이용한 구리 도금 전극 패터닝 형성 김경민, 조영준, 장효식 Korean Journal of Materials Research, 29(4), 228, 2019 |
| 2 |
Gradient filling of copper in porous silicon using a non-contact electrochemical method Zhao MR, Shadman FH, Keswani M Applied Surface Science, 445, 505, 2018 |
| 3 |
Effect of the deposition parameters on the voiding propensity of solder joints with Cu electroplated in a Hull cell Wafula F, Liu Y, Yin L, Borgesen P, Cotts EJ, Dimitrov N Journal of Applied Electrochemistry, 41(4), 469, 2011 |
| 4 |
Degradation of Poly(ethylene glycol) by Electrolysis During the Cu Electroplating: A Combined Experimental and Density Functional Theory Study Won YS, Cho D, Kim Y, Lee J, Park SS Journal of Applied Polymer Science, 117(4), 2083, 2010 |
| 5 |
Influence of Cu electroplating solutions on boron carbon nitride (BCN) film Aoki H, Hara M, Masuzumi T, Mazumder MK, Ooi N, Watanabe D, Kimura C, Sugino T Applied Surface Science, 255(6), 3719, 2009 |
| 6 |
Fabrication and characterization of Cu-Ni-YSZ SOFC anodes for direct use of methane via Cu-electroplating Park EW, Moon H, Park MS, Hyun SH International Journal of Hydrogen Energy, 34(13), 5537, 2009 |
| 7 |
Bottom-up copper fill with addition of mercapto alkyl carboxylic acid in electroless plating Wang ZL, Obata R, Sakaue H, Takahagi T, Shingubara S Electrochimica Acta, 51(12), 2442, 2006 |
| 8 |
Influence of copper content on NO removal of the activated carbon fibers produced by electroplating Park SJ, Shin JS Journal of Colloid and Interface Science, 264(1), 39, 2003 |
| 9 |
전해 동도금 처리에 의한 활성탄소섬유의 표면 특성 및 NO 제거 박수진, 신준식, 장유신 Journal of the Korean Industrial and Engineering Chemistry, 13(8), 777, 2002 |
| 10 |
Electrochemical deposition of Copper on patterned Cu/Ta(N)/SiO2 surfaces for super filling of sub-micron features Li WH, Ye JH, Li SFY Journal of Applied Electrochemistry, 31(12), 1395, 2001 |