검색결과 : 5건
| No. | Article |
|---|---|
| 1 |
아민과 카르복실산이 함유된 수계용액의 구리 배선 공정의 세정특성 고천광, 이원규 Korean Chemical Engineering Research, 59(4), 632, 2021 |
| 2 |
Diffusion barrier effect of Ta/Ti bilayer in organic dielectric/Cu interconnects Shang J, Hao JX, Hang T, Li M Thin Solid Films, 653, 113, 2018 |
| 3 |
Characteristics of electrodeposited CoWP capping layers using alkali-metal-free precursors Namkoung YM, Lee HM, Son YS, Lee K, Kim CK Korean Journal of Chemical Engineering, 27(5), 1596, 2010 |
| 4 |
Void-free anisotropic deposition for IC interconnect with polyethylene glycol as the single additive based on uneven adsorption distribution Wu BH, Wan CC, Wang YY Journal of Applied Electrochemistry, 33(9), 823, 2003 |
| 5 |
Effects of the high-pressure annealing process on the reflow phenomenon of copper interconnections for large scale integrated circuits Onishi T, Fujii H, Yoshikawa T, Munemasa J, Inoue T, Miyagaki A Thin Solid Films, 425(1-2), 265, 2003 |