검색결과 : 11건
| No. | Article |
|---|---|
| 1 |
The bioliq (R) Entrained-Flow Gasifier - a Module for the German Energiewende Eberhard M, Santo U, Boning D, Schmid H, Michelfelder B, Zimmerlin B, Gunther A, Weigand P, Muller-Hagedorn M, Stapf D, Kolb T Chemie Ingenieur Technik, 90(1-2), 85, 2018 |
| 2 |
Study on Stiffness and Conditioning Effects of CMP Pad Based on Physical Die-Level CMP Model Fan W, Boning D, Charns L, Miyauchi H, Tano H, Tsuji S Journal of the Electrochemical Society, 157(5), H526, 2010 |
| 3 |
Characterization of thermoset and thermoplastic polyurethane pads, and molded and non-optimized machined grooving methods for oxide chemical mechanical planarization applications Sampurno Y, Borucki L, Zhuang Y, Misra S, Holland K, Boning D, Philipossian A Thin Solid Films, 517(5), 1719, 2009 |
| 4 |
Molecular beam epitaxial growth of indium antimonide and its characterization Pharn HT, Yoon SF, Boning D, Wicaksono S Journal of Vacuum Science & Technology B, 25(1), 11, 2007 |
| 5 |
A method for direct measurement of substrate temperature during copper CMP Sampurno YA, Borucki L, Zhuang Y, Boning D, Philipossian A Journal of the Electrochemical Society, 152(7), G537, 2005 |
| 6 |
Estimating the effective pressure on patterned wafers during STI CMP Sorooshian J, Borucki L, Timon R, Stein D, Boning D, Hetherington D, Philipossian A Electrochemical and Solid State Letters, 7(10), G204, 2004 |
| 7 |
Arrhenius characterization of ILD and copper CMP processes Sorooshian J, DeNardis D, Charns L, Li Z, Shadman F, Boning D, Hetherington D, Philipossiana A Journal of the Electrochemical Society, 151(2), G85, 2004 |
| 8 |
Chip-scale modeling of electroplated copper surface profiles Park T, Tugbawa T, Boning D, Chidambaram C, Borst C, Shin G Journal of the Electrochemical Society, 151(6), C418, 2004 |
| 9 |
Characterization and modeling of dynamic thermal behavior in CMP White D, Melvin J, Boning D Journal of the Electrochemical Society, 150(4), G271, 2003 |
| 10 |
Wafer scale variation of planarization length in chemical mechanical polishing Oji C, Lee B, Ouma D, Smith T, Yoon J, Chung J, Boning D Journal of the Electrochemical Society, 147(11), 4307, 2000 |