Existing models of chemical mechanical polishing (CMP) focus on the impact of pressure, velocity, slurry, and pad parameters on material removal rate. To complement these models, we present a model and experimental data for thermal effects in CMP. The energy source and thermal loss mechanisms are calculated and an energy balance formulation is used to predict the energy exchanged between the pad and slurry flowing over it. Experiments are shown to be consistent with this prediction, suggesting that the most significant elements are accounted for. We also describe the dynamic aspect of the process whereby heat is accumulated in the pad during polish and lost to the slurry flowing over the pad while it rotates around before entering under the head again. Our studies indicate that this heating and cooling cycle may be responsible for the transient behavior observed at the beginning of each polish. To analyze the transient thermal behavior observed in the pad, we propose a lumped parameter dynamic model. Simulation results are seen to match well with experimental data for copper polishes. (C) 2003 The Electrochemical Society.