검색결과 : 3건
No. | Article |
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1 |
"Microfabrication of ultrahigh density wafer-level thin film compliant interconnects for through-silicon-via based chip stacks" (vol 24, pg 1780, 2006) Arunasalam P, Ackler HD, Sammakia BG Journal of Vacuum Science & Technology B, 25(1), 292, 2007 |
2 |
Microfabrication of ultrahigh density wafer-level thin film compliant interconnects for through-silicon-via based chip stacks Arunasalam P, Ackler HD, Sammakia BG Journal of Vacuum Science & Technology B, 24(4), 1780, 2006 |
3 |
Comparisons of Hamaker Constants for Ceramic Systems with Intervening Vacuum or Water - From Force Laws and Physical-Properties Ackler HD, French RH, Chiang YM Journal of Colloid and Interface Science, 179(2), 460, 1996 |