화학공학소재연구정보센터
학회 한국고분자학회
학술대회 2002년 가을 (10/11 ~ 10/12, 군산대학교)
권호 27권 2호, p.120
발표분야 고분자 가공/블렌드
제목 Thermal Properties and Fracture Toughness of Bisphenol A and S-based Difunctional Epoxy Blend System
초록 In this study, the different bisphenol-based DGEBA/DGEBS (diglycidylether of bisphenol-A/ diglycidylether of bisphenol-S) blend systems were investigated in terms of cure behaviors, thermal stabilities, and fracture toughness of the casting specimen. The contents of DGEBA/ DGEBS were varied with in the 100:0, 90:10, 80:20, 70:30, and 60:40 wt%. The cure activation energies (Ea) of the system were determined by Ozawa's equation with dynamic differential scanning calorimetry (DSC). The thermal stabilities, including initial decomposed temperature (IDT), temperatures of maximum rate of degradation (Tmax), integral procedural decomposition temperature (IPDT) of the cured specimen were investigated by thermogravimetric analysis (TGA). For the mechanical interfacial properties of the specimens, the critical stress intensity factor (KIC) test was performed and their fractured surfaces were examined by using a scanning electron microscope (SEM). As a result, Ea, IPDT, and KIC exhibited maximum values in the 20 wt% DGEBS content, compared with the neat DGEBA resins. This was probably due to the fact that the developed networks were formed by the introduction of sulfonyl groups of the DGEBS resins.
저자 김범용1, 박수진2, 이재락, 신재섭*
소속 1한국화학(연), 2*충북대
키워드 DGEBA; bisphenol-S; epoxy resin; fracture toughness; activation energy
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