| 학회 |
한국고분자학회 |
| 학술대회 |
2014년 봄 (04/10 ~ 04/11, 대전 컨벤션센터) |
| 권호 |
39권 1호 |
| 발표분야 |
고분자가공/복합재료- 미래 자동차용 고분자소재 최신기술 동향 |
| 제목 |
Enhanced thermal conductivity of epoxy/unidirectional carbon fiber composites with highly crystallized Cu shell via electroplating and annealing |
| 초록 |
We report a facile route to prepare epoxy/carbon fiber composites with Cu thermal conduction pathway along unidirectional carbon fiber via electroplating and compression molding. Cu on carbon fiber was formed by electroplating method for different period of plating time to get various thickness of Cu shell. The epoxy/Cu-pated carbon fiber composites with as-deposited Cu shell of 12.0 vol% thermal conductivities of 35.4 W/mK and 3.5 W/mK in parallel and perpendicular directions, respectively. Moreover, the rapid thermal annealling allow a recrystallization of as-deposited Cu shell on carbon fiber as well as enhanced thermal conductivity of 47.2 W/mK and 3.9 W/mK in parallel and perpendicular directions, respectively. |
| 저자 |
유승건1, 박철민2, 홍순만1, 구종민1
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| 소속 |
1한국과학기술(연), 2연세대 |
| 키워드 |
Thermal conductivity; Electroplating
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| E-Mail |
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