| 학회 | 한국공업화학회 |
| 학술대회 | 2017년 가을 (11/08 ~ 11/10, 부산 벡스코(BEXCO)) |
| 권호 | 21권 2호 |
| 발표분야 | 우수논문(구두)_박사과정 |
| 제목 | Development of binder resin using aromatic and vinyl polymer to fabricate IC-Substrate CCL with low dielectric constant |
| 초록 | In this study, styrene-maleic anhydride (SMA) copolymer is synthesized by copolymerization reaction with styrene and maleic anhydride to be adopted to a high frequency CCL board. The aromatic-anhydride copolymer was developed by substitution or addition and it is a biocompatible polymer which has both hydrophobic (aromatic monomer) and hydrophilic (maleic anhydride) functional groups. To analyze material properties, the synthesized SMA, Acrylic functional SMA copolymer (Nanokor, KOREA), and the commercialized product SMA copolymer (SMAⓇEF-40 Flake, Cray Valley, USA) products are compared. Through X-ray diffraction (XRD) and Nuclear Magnetic Resonance (NMR) analyses, the synthesis mechanism and molecular structure were investigated. Agilent 4284A Precision LCR Meter (20Hz to 1MHz) and Agilent N5230A Microwave Network Analyzer (~10GHz) are used for analysis of the dielectric constant and the dielectric loss for high frequency applications. |
| 저자 | 정헌상, 이현호 |
| 소속 | 명지대 |
| 키워드 | copper clad laminate (CCL); low dielectric constant; aromatic-anhydride copolymer |
