| 초록 |
Embedding is a common technology for miniaturization or performance improvement. In some cases, embedding also provides an overall product cost reduction. However, several challenges also come from the realization of this technology. These ranges from new processing step to new materials and associated reliability concerns. The main issue of reliability is relatied to bonding sheet for embedding IC. Especially, it is important to the thermomechanical properties and adhesion between Cu and bonding sheet. This paper is focused on lamination process and bonding sheet charac-terization for reliability. |
