| 학회 |
한국재료학회 |
| 학술대회 |
2017년 봄 (05/17 ~ 05/19, 목포 현대호텔) |
| 권호 |
23권 1호 |
| 발표분야 |
D. 구조 재료 분과 |
| 제목 |
Measurements of GBCD of electroplated Cu thin films using 2d EBSD maps |
| 초록 |
We measured grain boundary character distributions (GBCD) for electroplated Cu thin films by applying an in-house grain boundary approximation program on two-dimensional EBSD maps. Two Cu films were electroplated using the same conditions, but were annealed differently. Then, we observed the difference in microstructure and grain boundary texture as the annealing type varied. The origin of the difference is explained using previously reported theory. |
| 저자 |
김민지, 이석빈
|
| 소속 |
울산과학기술원(UNIST) |
| 키워드 |
electroplating; thin films; texture; 2d EBSD; reconstruction; GBCD; |
| E-Mail |
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