| 학회 | 한국재료학회 |
| 학술대회 | 2005년 가을 (11/10 ~ 11/11, 한양대학교) |
| 권호 | 11권 2호 |
| 발표분야 | 전자재료 |
| 제목 | 고휘도 LED 패키지에 있어서 Encapsulation의 Yellowing 평가 |
| 초록 | It is widely known about the use of silicon resin for microelectronics packaging, including Fiber optics, LED, LCD. In particular, Many engineers are developing White LED Packing in the world. The white LED package is used normal transparent silicon resin as encapsulant. But normal transparent silicon resin discolors by UV lighting. humidity and heating, which will impede the thermal transfer. It is difficult to preserve white color for a long time after packaging. It must be clear, colorless, non-yellowing encapsulant to maintanin the high optical and thermal properties General LED packaging method is used casting molding method. This method can't produce high density. light weight, precise shape packagint with low cost. The first time, we carried out encapsulation by dotting method in LED packing that is used in various refractive index silicon resins. we evluated the yellowig effect according to UV, theraml, humidity. we will have the best choose to be used as encapsulant in high power LED package. Reference 1. Procedings of the 36th Annual IMAPS Conference, Boston MA, Nov 17~20, 2003, pp. 26~30 2. 2003 Electronic Components and Technology Conference, pp. 1599~1601 3. Chris Perabo, Loctite Technical paper, " Critical adhesive requirements for optoelectronic packaing, Oct, 2001, 4. Tom Green. "Optoelectronics Packaging Challenges and Solutions", Journal of Advancing Electronics, Vol. 29, No. 1, pp. 8, Jan/Feb, 2002 5. K. Bando, et al. " Development fof high bright and pure white LED lamps", Journal of Light & Vis. Environ. Vol. 22, No.1 pp. 2~5 (1998) |
| 저자 | 김용석, 최석문, 김용식 |
| 소속 | 삼성전기 eMD LAB |
| 키워드 | LED 패키지; yellowing; silicon resin; dotting |
