| 학회 |
한국고분자학회 |
| 학술대회 |
2007년 봄 (04/12 ~ 04/13, 제주 ICC) |
| 권호 |
32권 1호 |
| 발표분야 |
고분자 구조 및 물성 |
| 제목 |
Effects of the Microstructures of Fillers on Thermal Conductivity of Polyethylene Composites |
| 초록 |
Polymers are often processed with the addition of various kinds of fillers and additives in order to obtain final product of improved physical properties. Thermal conductivity of composite materials are also strongly dependent on the filler properties as well as on microstructural parameters such as diameter, length, volume fraction and the packing arrangement of fillers. In this study, several polyethylene composites filled with various types of filler were prepared to estimate the effect of microstructures of fillers on thermal conductivity of polymer composites. In order to understand the relation between conductive chain paths of fillers and thermal conductivity, we applied our experimental data to Agari equation and calculated the Cf, a factor related to ease in forming conductive chains of filler. Also, these factors were explained by the average contact number of various fillers which were calculated by the material packaging simulation tool, MacroPac. |
| 저자 |
박희준, 김준경, 김동민, 조원근, 박승빈, 박민
|
| 소속 |
한국과학기술(연) |
| 키워드 |
Thermal conductivity; Polymer composite
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| E-Mail |
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