| 초록 |
The mismatch in thermal expansion coefficient and the Young’s modulus may generate thermal stress in the metal/polymer structure during thermal cycling. Since thermal cycling is a typical procedure during fabrication, polymer curing and multilayered device manufacturing, it is important to understand the mechanical properties of the metal/polymer structure, particularly the nature of stress relaxation during thermal cycling. Due to volatilization of different volume by-products during curing process, the morphological structure and chain rigidity of polyimide thin films can be changed. For this study, a computer-controlled experiment has been set up to measure the thermal stress of multilayered films using in-situ bending wafer technique. To understand and classify these phenomena, the bending beam technique for thermal stresses kinetics according to imidization history and thermal cycling in polyimide nanocomposites prepared from various inorganic nanoparticles were used. |
