| 초록 |
As the semi-conductor chips become thinner and highly integrated, more reliable dicing adhesives, which have enough adhesive strength on the wafer backside to prevent the semi-conductor chips from shooting and shaking during the chip making process, are needed. Many acrylic adhesives have such problems in dicing as maintaining strong adhesion strength and remaining residues of adhesive on the chip surface after UV curing. In this study, the effect of bi-fuctional and hexa-functional oligomers on the variation of adhesion characteristics of dicing after UV curing was investigated in terms of such viscoelatic parameters as storage modulus, viscosity, and loss factor. |
